Putting the award page together from the records…
Putting the award page together from the records…
DPA TITLE III PROGRAM, PRINTED CIRCUIT BOARD ASSEMBLY PRODUCTION & TEST FOR HYPERSONIC MISSILES
SpendQuery holds FY2023 on; earlier years are on USAspending.gov.
No subawards reported for this award. Primes report subawards of $30,000 or more; many awards have none.
4 actions since 2024-02-26. Each is a modification or amendment with the money it added or took back.
| Date | Amendment | Kind | Amount | What the agency wrote |
|---|---|---|---|---|
| 2026-07-22 | P00003 | Revision | $0 | PRINTED CIRCUIT BOARD ASSEMBLY PRODUCTION & TEST FOR HYPERSONIC MISSILES |
| 2025-02-18 | P00002 | Continuation | $0 | PRINTED CIRCUIT BOARD ASSEMBLY PRODUCTION & TEST FOR HYPERSONIC MISSILES |
| 2024-05-03 | P00001 | Continuation | $0 | DPA TITLE III PROGRAM, PRINTED CIRCUIT BOARD ASSEMBLY PRODUCTION & TEST FOR HYPERSONIC MISSILES |
| 2024-02-26 | 0 | New award | $11.69M | DPA TITLE III PROGRAM, PRINTED CIRCUIT BOARD ASSEMBLY PRODUCTION & TEST FOR HYPERSONIC MISSILES |
Source: USAspending.gov prime award transactions and FSRS subaward reports, as loaded by SpendQuery (data as of 2026-09-30). Amounts are obligations (money committed), not outlays. The official record on USAspending.gov ↗