HR00112430347↗

Name: HR00112430347: The Purpose of This Agreement Is to Create a National Capability for Three Dimensional Heterogeneous Integration 3Dhi Manufacturing and Pursue Focused Research in Manufacturing Complex 3D Microsystems and Developing Electronics for Extreme Environments. to Accomplish This, This Agreements Seeks to Facilitate the Establishment of a Domestic Self Sustaining Entity Offering an Open Access 3Dhi Microsystem Prototyping and Pilot Line Manufacturing Capability.
Creator: SpendQuery
License: https://www.usa.gov/government-works

THE PURPOSE OF THIS AGREEMENT IS TO CREATE A NATIONAL CAPABILITY FOR THREE DIMENSIONAL HETEROGENEOUS INTEGRATION 3DHI MANUFACTURING AND PURSUE FOCUSED RESEARCH IN MANUFACTURING COMPLEX 3D MICROSYSTEMS AND DEVELOPING ELECTRONICS FOR EXTREME ENVIRONMENTS. TO ACCOMPLISH THIS, THIS AGREEMENTS SEEKS TO FACILITATE THE ESTABLISHMENT OF A DOMESTIC SELF SUSTAINING ENTITY OFFERING AN OPEN ACCESS 3DHI MICROSYSTEM PROTOTYPING AND PILOT LINE MANUFACTURING CAPABILITY.

Other Reimbursable, Contingent, Intangible, or Indirect Financial Assistance · Defense Advanced Research Projects Agency · to University of Texas at Austin (UEI V6AFQPN18437) · data as of 2026-10-21

Obligated to date$420.00M10 actions

Period2024-07-11 → 2026-08-13first to last action

Passed on$103.42Mto 1 subrecipient

What it is

Program: Research and Technology Development (Assistance Listing 12.910)
Where the work is: Travis, TX · district TX-25

Obligations by fiscal year

FY2024$215.84M

FY2025$75.01M

FY2026$129.15M

SpendQuery holds FY2023 on; earlier years are on USAspending.gov.

Subrecipients: where the money went next

35 subawards totaling $103.42M (24.6% of what was obligated), as University of Texas at Austin reported them. Primes report subawards of $30,000 or more; smaller ones and unreported ones aren't here.

Subrecipient	Amount	Subawards	Where	First	Last
University of Texas System	$103.42M	35	CA, FL, GA, IN, MA, MO, NM, NY, PA, TX, VA	2024-12-11	2026-03-06

The largest single subawards

Date	To	Amount	For
2024-12-20	Raytheon Company	$18.01M	TEXAS INSTITUTE FOR ELECTRONICS (TIE) NEXT-GENERATION MICROELECTRONICS MANUFACTURING (NGMM) CENTER (TNC).
2025-03-13	HRL Laboratories, LLC	$12.86M	TEXAS INSTITUTE FOR ELECTRONICS (TIE) NEXT-GENERATION MICROELECTRONICS MANUFACTURING (NGMM) CENTER (TNC).
2024-12-11	Zero Asic Corp	$8.83M	TEXAS INSTITUTE FOR ELECTRONICS (TIE) NEXT-GENERATION MICROELECTRONICS MANUFACTURING (NGMM) CENTER (TNC)
2025-05-01	Lockheed Martin Corporation	$7.53M	TEXAS INSTITUTE FOR ELECTRONICS (TIE) NEXT-GENERATION MICROELECTRONICS MANUFACTURING (NGMM) CENTER (TNC).
2025-07-31	Northrop Grumman Systems Corporation	$7.45M	TEXAS INSTITUTE FOR ELECTRONICS (TIE) NEXT-GENERATION MICROELECTRONICS MANUFACTURING (NGMM) CENTER (TNC).
2024-12-20	Cadence Design Systems Inc	$5.31M	TEXAS INSTITUTE FOR ELECTRONICS (TIE) NEXT-GENERATION MICROELECTRONICS MANUFACTURING (NGMM) CENTER (TNC).
2025-03-17	Teledyne Scientific & Imaging, LLC	$5.25M	TEXAS INSTITUTE FOR ELECTRONICS (TIE) NEXT-GENERATION MICROELECTRONICS MANUFACTURING (NGMM) CENTER (TNC)

Every action

10 actions since 2024-07-11. Each is a modification or amendment with the money it added or took back.

Date	Amendment	Kind	Amount	What the agency wrote
2026-08-13	P00009	Revision	$0	NEXT-GENERATION MICROELECTRONICS MANUFACTURING (NGMM)
2026-04-06	P00008	Revision	$52.25M	NEXT-GENERATION MICROELECTRONICS MANUFACTURING (NGMM)
2025-12-04	P00007	Revision	$76.90M	TEXAS INSTITUTE FOR ELECTRONICS (TIE) NEXT-GENERATION MICROELECTRONICS MANUFACTURING (NGMM) CENTER (TNC)
2025-08-08	P00006	Revision	$0	THE PURPOSE OF THIS MODIFICATION IS TO CODIFY THE FOLLOWING CHANGES TO THE AGREEMENT 1 ARTICLE 3 MANAGEMENT OF THE PROJECT IS UPDATED TO INCORPORATE LANGUAGE REGARDING THE REVISION OF PHASE 2 MILESTONES. 2. ARTICLE 4 AGREEMENT ADMINISTRATION IS UPDATED TO…
2025-06-03	P00005	Continuation	$74.23M	THE PURPOSE OF THIS MODIFICATION IS TO APPLY INCREMENTAL FUNDING IN THE AMOUNT OF $74,232,001 ACRN AE TO CLIN 0002.
2025-04-02	P00004	Continuation	$0	TEXAS INSTITUTE FOR ELECTRONICS (TIE) NEXT-GENERATION MICROELECTRONICS MANUFACTURING (NGMM) CENTER (TNC)
2025-01-27	P00003	Continuation	$777.9K	THE PURPOSE OF THIS BILATERAL MODIFICATION IS TO APPLY INCREMENTAL FUNDING IN THE AMOUNT OF $777,885 TO CLIN 0002.
2024-12-04	P00002	Revision	$0	THE PURPOSE OF THIS BILATERAL MODIFICATION IS TO INCORPORATE VARIOUS UPDATES INTO ATTACHMENT 1 TASK DESCRIPTION DOCUMENT, AND ATTACHMENT 3 SCHEDULE OF KEY MILESTONES. THERE IS NO CHANGE TO TOTAL AMOUNT OF THE AGREEMENT OR TERM. ATTACHMENT
2024-09-23	P00001	Continuation	$0	THE PURPOSE OF THIS AGREEMENT IS TO CREATE A NATIONAL CAPABILITY FOR THREE DIMENSIONAL HETEROGENEOUS INTEGRATION 3DHI MANUFACTURING AND PURSUE FOCUSED RESEARCH IN MANUFACTURING COMPLEX 3D MICROSYSTEMS AND DEVELOPING ELECTRONICS FOR EXTREME ENVIRONMENTS. TO…

Source: USAspending.gov prime award transactions and FSRS subaward reports, as loaded by SpendQuery (data as of 2026-10-21). Amounts are obligations (money committed), not outlays. The official record on USAspending.gov ↗

Putting the award page together from the records…