140D0424C0065↗

Name: 140D0424C0065: Large Area, High Quality Electronic Grade Diamond Via Innovative Seed Cloning and Tiling Processes for Ultra-Wide Bandgap Semiconductors (Uwbgs)
Creator: SpendQuery

LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS)

Definitive Contract · Departmental Offices · to The Pennsylvania State University (UEI NPM2J7MSCF61) · data as of 2026-09-30

Obligated to date$6.30M7 actions

Current value$6.30Mwith options exercised

Period2024-08-01 → 2027-09-30current end date

Up for re-bid: ends 2027-09-30. Recompete brief → · A--DOI-ETA-FY26-30 ↗

What it is

Product or service: General Science and Technology R&D Services; General Science and Technology; Applied Research (PSC AJ12)
Industry: Research and Development in the Physical, Engineering, and Life Sciences (Except Nanotechnology and Biotechnology) (NAICS 541715)
Funded by: Department of Defense
Contracting office: Ibc Acq Svcs Directorate (00004) (140D04)
Competition: Full and open competition · 25 offers received
Pricing: Cost plus award fee
How it was bought: Standalone contract
Solicitation: HR001123S0051
Where the work is: Centre, PA · district PA-15
Topics: semiconductors

Obligations by fiscal year

FY2024$949.8K

FY2025$2.31M

FY2026$3.04M

SpendQuery holds FY2023 on; earlier years are on USAspending.gov.

Subcontractors: where the money went next

No subawards reported for this award. Primes report subawards of $30,000 or more; many awards have none.

Every action

7 actions since 2024-07-31. Each is a modification or amendment with the money it added or took back.

Date	Modification	Kind	Amount	What the agency wrote
2026-09-04	P00006	Option exercised	$1.94M	LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS)
2026-07-07	P00005	Supplemental agreement (work within scope)	$0	EO 14398 - BILATERAL MOD TO ADD FAR 52.222-90, AND EXTEND THE PERIOD OF PERFORMANCE OF THE CONTRACT AT NO ADDITIONAL COST TO THE GOVERNMENT. LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA
2026-01-12	P00004	Funding only	$579.6K	LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS)
2025-12-05	P00003	Administrative change	$0	LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS)
2025-11-13	P00002	Funding only	$515.0K	LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS)
2025-01-16	P00001	Funding only	$2.31M	LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS)
2024-07-31	0		$949.8K	LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING PROCESSES FOR ULTRA-WIDE BANDGAP SEMICONDUCTORS (UWBGS)

Source: USAspending.gov prime award transactions and FSRS subaward reports, as loaded by SpendQuery (data as of 2026-09-30). Amounts are obligations (money committed), not outlays. The official record on USAspending.gov ↗