FA238524CB004↗

Qorvo Texas, LLC received this contract from Fa2377 Usaf Afmc Afrl PZL Afrl Ryks, Department of the Air Force: $10.98M obligated so far for national defense r&d services; department of defense - military; applied research. It runs to 2027-12-18.

Key facts · data as of Oct 23, 2026

Recipient
Qorvo Texas, LLC
Awarding agency
Department of the Air Force (Department of Defense)
Contracting office
Fa2377 Usaf Afmc Afrl PZL Afrl Ryks (FA2377)
Obligated to date
$10.98M
Potential value
$11.89M
Ends
2027-12-18

Source: USAspending.gov prime award records (obligations: money committed, not outlays), data as of Oct 23, 2026.

Cite this page: SpendQuery, Award FA238524CB004, data as of Oct 23, 2026, https://spendquery.com/award?id=CONT_AWD_FA238524CB004_9700_-NONE-_-NONE-

EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN)

Definitive Contract · Department of the Air Force · to Qorvo Texas, LLC (UEI XJDBBAYPDNK3) · data as of 2026-10-23

Obligated to date$10.98M11 actions
Current value$11.89Mwith options exercised
Period2023-11-17 → 2027-12-18current end date

Up for re-bid: ends 2027-12-18. Recompete brief → · Trusted and Elastic Military Platforms and Electronic Warfare (EW) System Technologies (TEMPEST) ↗

What it is

Product or service
National Defense R&D Services; Department of Defense - Military; Applied Research (PSC AC12)
Industry
Research and Development in the Physical, Engineering, and Life Sciences (Except Nanotechnology and Biotechnology) (NAICS 541715)
Contracting office
Fa2377 Usaf Afmc Afrl PZL Afrl Ryks (FA2377)
Competition
Full and open competition · 6 offers received
Pricing
Cost plus fixed fee
How it was bought
Standalone contract
Solicitation
HR001123S0013
Where the work is
Collin, TX · district TX-32

Obligations by fiscal year

FY2024$5.14M
FY2025$1.80M
FY2026$4.05M

SpendQuery holds FY2023 on; earlier years are on USAspending.gov.

Subcontractors: where the money went next

No subawards reported for this award. Primes report subawards of $30,000 or more; many awards have none.

Every action

11 actions since 2023-11-16. Each is a modification or amendment with the money it added or took back.

DateModificationKindAmountWhat the agency wrote
2026-07-02P00010Funding only$1.25MEXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
2026-06-24P00009Administrative change$0EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
2026-04-29P00008Supplemental agreement (work within scope)$2.80MEXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
2025-09-10P00007Option exercised$1.80MEXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
2025-08-07P00006Administrative change$0EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
2025-04-24P00005Supplemental agreement (work within scope)$0EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
2025-03-26P00004Supplemental agreement (work within scope)$0EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
2024-06-13P00003Funding only$850.1KEXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
2024-02-06P00002Administrative change$0EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN
2023-12-21P00001Funding only$2.79MEXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)
2023-11-160$1.50MEXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN)

Source: USAspending.gov prime award transactions and FSRS subaward reports, as loaded by SpendQuery (data as of 2026-10-23). Amounts are obligations (money committed), not outlays. The official record on USAspending.gov ↗