Putting the award page together from the records…
Putting the award page together from the records…
THE MINITHERMS3D PROGRAM SEEKS TO SIGNIFICANTLY REDUCE THERMAL RESISTANCES WITHIN THE 3D STACK AND EXTERNAL TO THE STACK OF 3DHI SYSTEMS, WHILE INCREASING VOLUMETRIC HEAT REMOVAL.
Up for re-bid: ends 2028-01-29. Recompete brief → · Atomically Precise Molecules (APM) ↗
SpendQuery holds FY2023 on; earlier years are on USAspending.gov.
2 subawards totaling $325.5K (2.2% of what was obligated), as Teledyne Scientific & Imaging, LLC reported them. Primes report subawards of $30,000 or more; smaller ones and unreported ones aren't here.
| Subcontractor | Amount | Subawards | Where | First | Last |
|---|---|---|---|---|---|
| Micross Advanced Interconnect Technology LLC | $292.5K | 1 | NC | 2024-01-16 | 2024-01-16 |
| Kyocera Corporation | $33.0K | 1 | CA | 2024-12-17 | 2024-12-17 |
| Date | To | Amount | For |
|---|---|---|---|
| 2024-01-16 | Micross Advanced Interconnect Technology LLC | $292.5K | DEVELOPMENT OF COOHLIT MICROSS SILICON TSV PROCESSING |
| 2024-12-17 | Kyocera International Inc | $33.0K | POST PROCESS OF 3DHI PROCESS DEVELOPMENT: PROJECT F 3-TILE STACK TO PCB ASSEMBLY USING SOLDER BALL BONDING |
10 actions since 2023-11-09. Each is a modification or amendment with the money it added or took back.
| Date | Modification | Kind | Amount | What the agency wrote |
|---|---|---|---|---|
| 2026-04-23 | P00009 | Funding only | $599.0K | MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D). |
| 2026-03-19 | P00008 | Funding only | $3.49M | MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D). |
| 2026-03-09 | P00007 | Funding only | $2.83M | MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D). |
| 2026-01-29 | P00006 | Supplemental agreement (work within scope) | $519.4K | MINIATURE INTEGRATED THERMAL MANAGEMENT SYSTEMS FOR 3D HETEROGENEOUS INTEGRATION (MINITHERMS3D). |
| 2025-08-27 | P00005 | Supplemental agreement (work within scope) | $600.0K | THE MINITHERMS 3D PROGRAM SEEKS TO SIGNIFICANTLY REDUCE THERMAL RESISTANCES WITHIN THE 3D STACK AND EXTERNAL TO THE STACK OF 3DHI SYSTEMS, WHILE INCREASING VOLUMETRIC HEAT REMOVAL. |
| 2025-04-03 | P00004 | Administrative change | $0 | THE MINITHERMS 3D PROGRAM SEEKS TO SIGNIFICANTLY REDUCE THERMAL RESISTANCES WITHIN THE 3D STACK AND EXTERNAL TO THE STACK OF 3DHI SYSTEMS, WHILE INCREASING VOLUMETRIC HEAT REMOVAL. |
| 2024-06-20 | P00003 | Funding only | $853.1K | THE MINITHERMS3D PROGRAM SEEKS TO SIGNIFICANTLY REDUCE THERMAL RESISTANCES WITHIN THE 3D STACK AND EXTERNAL TO THE STACK OF 3DHI SYSTEMS, WHILE INCREASING VOLUMETRIC HEAT REMOVAL. |
| 2024-05-15 | P00002 | Funding only | $1.76M | THE MINITHERMS3D PROGRAM SEEKS TO SIGNIFICANTLY REDUCE THERMAL RESISTANCES WITHIN THE 3D STACK AND EXTERNAL TO THE STACK OF 3DHI SYSTEMS, WHILE INCREASING VOLUMETRIC HEAT REMOVAL. |
| 2024-03-07 | P00001 | Funding only | $649.1K | THE MINITHERMS3D PROGRAM SEEKS TO SIGNIFICANTLY REDUCE THERMAL RESISTANCES WITHIN THE 3D STACK AND EXTERNAL TO THE STACK OF 3DHI SYSTEMS, WHILE INCREASING VOLUMETRIC HEAT REMOVAL. |
| 2023-11-09 | 0 | $3.34M | THE MINITHERMS3D PROGRAM SEEKS TO SIGNIFICANTLY REDUCE THERMAL RESISTANCES WITHIN THE 3D STACK AND EXTERNAL TO THE STACK OF 3DHI SYSTEMS, WHILE INCREASING VOLUMETRIC HEAT REMOVAL. |
Source: USAspending.gov prime award transactions and FSRS subaward reports, as loaded by SpendQuery (data as of 2026-10-20). Amounts are obligations (money committed), not outlays. The official record on USAspending.gov ↗