Putting the award page together from the records…
Putting the award page together from the records…
DEVELOP A MODE LOCKED LASER ON CHIP THAT WILL COMBINE THE ROBUSTNESS OF THE FIBER LASER APPROACH AND THE MINIATURIZATION AND FABRICATION ADVANTAGES OF PHOTONICS INTEGRATED CIRCUITS (PICS).
Up for re-bid: ends 2028-04-06. Recompete brief →
SpendQuery holds FY2023 on; earlier years are on USAspending.gov.
No subawards reported for this award. Primes report subawards of $30,000 or more; many awards have none.
4 actions since 2026-03-19. Each is a modification or amendment with the money it added or took back.
| Date | Modification | Kind | Amount | What the agency wrote |
|---|---|---|---|---|
| 2026-05-14 | P00003 | Administrative change | $0 | DEVELOP A MODE LOCKED LASER ON CHIP THAT WILL COMBINE THE ROBUSTNESS OF THE FIBER LASER APPROACH AND THE MINIATURIZATION AND FABRICATION ADVANTAGES OF PHOTONICS INTEGRATED CIRCUITS (PICS). |
| 2026-05-12 | P00002 | Administrative change | $0 | DEVELOP A MODE LOCKED LASER ON CHIP THAT WILL COMBINE THE ROBUSTNESS OF THE FIBER LASER APPROACH AND THE MINIATURIZATION AND FABRICATION ADVANTAGES OF PHOTONICS INTEGRATED CIRCUITS (PICS). |
| 2026-03-24 | P00001 | Administrative change | $0 | DEVELOP A MODE LOCKED LASER ON CHIP THAT WILL COMBINE THE ROBUSTNESS OF THE FIBER LASER APPROACH AND THE MINIATURIZATION AND FABRICATION ADVANTAGES OF PHOTONICS INTEGRATED CIRCUITS (PICS). |
| 2026-03-19 | 0 | $2.09M | DEVELOP A MODE LOCKED LASER ON CHIP THAT WILL COMBINE THE ROBUSTNESS OF THE FIBER LASER APPROACH AND THE MINIATURIZATION AND FABRICATION ADVANTAGES OF PHOTONICS INTEGRATED CIRCUITS (PICS). |
Source: USAspending.gov prime award transactions and FSRS subaward reports, as loaded by SpendQuery (data as of 2026-09-30). Amounts are obligations (money committed), not outlays. The official record on USAspending.gov ↗