Putting the topic page together from the records…
Putting the topic page together from the records…
The current fiscal year is still being reported (Defense contracts arrive about 90 days late).
Awards are tagged by words in their description; Jev (an AI that answers yes/no with a probability, not text) judged whether each of the 3,542 word-tagged awards is really about semiconductors and microelectronics and which kind. The numbers themselves come from the records. The largest left out:
Each award's description says which side it's on; its product or service code says what kind of purchase it is.
| Type | Kind of purchase | Obligations | Awards | Leading suppliers |
|---|---|---|---|---|
| Research and development | $384.76M | 128 | Raytheon Company · Northrop Grumman Corporation · Booz Allen Hamilton Inc | |
| Equipment and parts | $378.90M | 3,594 | Globalfoundries U.S. 2 LLC · Raytheon Company · Bae Systems Information and Electronic Systems Integration Inc. | |
| Grants and other assistance | $217.45M | 457 | Srcco Inc. · The Regents of the University of California · North Carolina State University | |
| Maintenance, repair and field support | $35.40M | 31 | Northrop Grumman Corporation · Blackwatch International Corporation · Bae Systems Information and Electronic Systems Integration Inc. | |
| Engineering, technical and professional support | $25.98M | 18 | International Business Machines Corporation · RB Management Consultants II LLC · Microchip Technology Inc | |
| Other services | $23.76M | 9 | Gilbane-Exyte a Joint Venture · Fortis Native Group LLC · CH2M - Burns & Mcdonnell Joint Venture |
Companies with semiconductors and microelectronics contracts, largest first (the top 30 of 672). Grants are listed below.
| Supplier | Obligations | Contracts | What | Buyers | Largest contract |
|---|---|---|---|---|---|
| Raytheon Company | $318.36M | 63 | Research and development · Equipment and parts | Department of Defense | HQ072723F1614 · $158.96M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE… |
| Globalfoundries U.S. 2 LLC | $99.24M | 3 | Equipment and parts | Department of Defense | HQ072716C0001 · $81.92M · TRUSTED FOUNDRY ACCESS 2 - AWARD OF BASE TRANSITION CONTRACT WITH DMEA. CONTRACT… |
| Northrop Grumman Corporation | $86.16M | 17 | Research and development · Maintenance, repair and field support | Department of Defense | HQ072723F1410 · $25.77M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE… |
| Bae Systems Information and Electronic Systems Integration Inc. | $71.41M | 3 | Equipment and parts | Department of Defense | FA880721C0003 · $70.83M · GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER… |
| L3Harris Technologies, Inc | $58.39M | 15 | Equipment and parts | Department of Defense | FA880721C0005 · $47.15M · GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER… |
Each opens its own page: every action, the terms, and who the money went to next. “Why here” is the word in its description that tagged it.
| Award | To | Agency | What | Obligations | Description | Why here |
|---|---|---|---|---|---|---|
| HQ072723F1614 | Raytheon Company | Department of Defense | Research and development | $158.96M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ANALYZE, DESIGN, DEVELOP, PROTOTYPE, PROCURE AND DEPLOY OPERATIONAL ENHANCEMENTS… | “microelectronic” possibly only a mention |
| HQ072716C0001 | Globalfoundries U.S. 2 LLC | Department of Defense | Equipment and parts | $81.92M | TRUSTED FOUNDRY ACCESS 2 - AWARD OF BASE TRANSITION CONTRACT WITH DMEA. CONTRACT TRANSFERRED FROM NSA. | “foundry” |
| FA880721C0006 | Raytheon Company | Department of Defense | Equipment and parts | $75.41M | GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER CARD PROGRAM WITH NEXT GENERATION APPLICATION SPECIFIC INTEGRATED CIRCUIT INCREMENT 2 | “integrated circuit” |
| FA880721C0003 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Equipment and parts | $70.83M | GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER CARD PROGRAM WITH NEXT GENERATION APPLICATION SPECIFIC INTEGRATED CIRCUIT INCREMENT 2 | “integrated circuit” |
| HQ072723F1606 |
How awards are tagged: their product or program code, or words in the award's original description (chips, CHIPS Act, semiconductor, microelectronics…), minus known noise. A description can mention the topic in passing, so check an award's own page. Source: USAspending.gov prime awards, FY2023 on; amounts are obligations (money committed), not outlays.
| Gilbane-Exyte a Joint Venture | $20.61M | 1 | Other services | Department of Defense | W912WJ22C0002 · $20.61M · CONSTRUCTION OF ADVANCED COMPOUND SEMICONDUCTOR LABORATORY/MICROSYSTEM INTEGRATION… |
| Booz Allen Hamilton Inc | $17.38M | 1 | Research and development | Department of Defense | FA807521F0005 · $17.38M · MICROELECTRONICS ASSURANCE FOR SECURE TRUSTWORTHY ELECTRONICS RESEARCH (MASTER) |
| Marvell Government Solutions LLC | $12.95M | 1 | Equipment and parts | Department of Defense | HQ072720C4000 · $12.95M · AWARD SEPARATING ASIC SOW. |
| Blackwatch International Corporation | $10.40M | 3 | Maintenance, repair and field support | Department of Defense | HQ072723F0100 · $7.27M · MANUFACTURING SUSTAINMENT AND ENGINEERING SUPPORT SERVICES TO DESIGN, FABRICATE,… |
| International Business Machines Corporation | $9.63M | 1 | Engineering, technical and professional support | Department of Defense | HQ072723F4000 · $9.63M · MARQUESAS RELOCATION DESIGN & INSTALLATION SERVICES TO DESIGN, FABRICATE, ASSEMBLE,… |
| Battelle Memorial Institute | $9.48M | 2 | Research and development | Department of Defense | FA865023C1000 · $9.48M · MICROELECTRONICS EMBEDDED SYSTEM AND ASSURANCE II |
| RB Management Consultants II LLC | $8.99M | 2 | Engineering, technical and professional support | Department of Commerce | 1333ND23PNB130096 · $4.50M · FOLLOW-ON SEMICONDUCTOR ANALYSIS, PROGRAM MANAGEMENT, AND CONTENT DEVELOPMENT SUPPORT |
| Bae Systems Information and Electronic Systems Integration Inc. | $8.53M | 10 | Research and development · Maintenance, repair and field support | Department of Defense | HQ072723F1201 · $4.50M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE… |
| Riverside Research Institute | $6.92M | 2 | Research and development | Department of Defense | FA865023C1001 · $6.92M · MICROELECTRONICS AND EMBEDDED SYSTEM ASSURANCE II |
| Gentex Corporation | $5.80M | 4 | Equipment and parts | Department of Defense | FA860620F0011 · $4.48M · ALEP BLOCK III DAY SPECTACLES |
| Icamr, Inc. | $5.56M | 2 | Research and development | Department of Defense · Department of the Interior | FA865020C1911 · $2.81M · TRUSTED SEMICONDUCTOR MANUFACTURING PILOT PROJECT |
| Microchip Technology Inc | $5.00M | 3 | Engineering, technical and professional support · Equipment and parts | Department of Defense · National Aeronautics and Space Administration | HQ072723C0012 · $4.82M · MITIGATING OBSOLESCENCE OF MIL-PRF-19500 TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST,… |
| Itc-De, LLC | $4.92M | 1 | Research and development | Department of Commerce | 1333ND23PNB100023 · $4.92M · NIST CHIPS ACT FOR NATIONAL SEMICONDUCTOR TECHNOLOGY CENTER (NSTC) DESIGN STUDY |
| Bogue Systems Inc | $2.83M | 11 | Equipment and parts | Department of Defense | N0010423CDA17 · $1.45M · ASSEMBLY,POWER MODU |
| Sheaumann Laser, Inc. | $2.77M | 2 | Equipment and parts | Department of Defense | H9240323F0057 · $2.77M · ILLUMINATE KIT |
| Silicon Technologies Inc | $2.63M | 1 | Research and development | Department of Defense | FA945323CA036 · $2.63M · ADVANCED ANALOG & MIXED SIGNAL RAD HARD MICROELECTRONICS DESIGN AND MANUFACTURING PROGRAM. |
| The Boeing Company | $2.52M | 8 | Research and development · Equipment and parts | Department of Defense | FA865023C7321 · $2.51M · NEXT GENERATION MICROELECTRONICS MANUFACTURING PHASE 0 - THREE-DIMENSIONAL HETEROGENEOUS… |
| Fortis Native Group LLC | $2.41M | 1 | Other services | Department of Defense | HQ072723F0500 · $2.41M · PREVENTATIVE MAINTENANCE SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE,… |
| Spectra Systems Corporation | $2.00M | 1 | Equipment and parts | Department of the Treasury | 2031ZA23C00036 · $2.00M · ONLINE QUALITY CONTROL UNIT, THIRD GENERATION |
| Mil-Aero Solutions Inc | $1.80M | 160 | Equipment and parts | Department of Defense | SPE7M523P5959 · $220.9K · 8510041949!MICROCIRCUIT,DIGITA |
| Leidos Holdings, Inc. | $1.76M | 1 | Research and development | Department of Defense | FA945118C0014 · $1.76M · IGF::OT::IGF COMPACT SEMICONDUCTOR MID- AND LONG-WAVE OPTO-ELECTRONICS RESEARCH (COSMO) |
| Avnet, Inc. | $1.73M | 197 | Equipment and parts · Research and development | Department of Defense · National Aeronautics and Space Administration | SPE7M523P0536 · $203.8K · 8509487373!MICROCIRCUIT,DIGITA |
| H Nu Photonics LLC | $1.59M | 1 | Research and development | Department of Defense | SP470123C0092 · $1.59M · XTG SMART TAG SYSTEM FOR MODERNIZING MICROELECTRONICS SUPPLY CHAIN TRACKING AND… |
| Connected Alliances LLC | $1.50M | 2 | Engineering, technical and professional support | Department of Defense | FA701423F0042 · $1.25M · PKH - SANTOS - PRYMAK - AFRL MICROELECTRONICS WORKFORCE SHAPING PATHFINDER |
| Metamorph Inc | $1.49M | 1 | Research and development | Department of Defense | W912CG23C0014 · $1.49M · DARPA SBIR PH II-- "SIDE CHANNEL OVERWATCH FOR MICROELECTRONICS" |
| Raytheon Company |
| Department of Defense |
| Research and development |
| $51.29M |
| THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR DESIGN, DEVELOPMENT AND OPERATIONAL ENHANCEMENTS FOR THE SENSE & WARN AND… |
| “microelectronic” possibly only a mention |
| FA880721C0005 | L3Harris Technologies, Inc | Department of Defense | Equipment and parts | $47.15M | GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER CARD PROGRAM WITH NEXT GENERATION APPLICATION SPECIFIC INTEGRATED CIRCUIT INCREMENT | “integrated circuit” |
| HQ072723F1410 | Northrop Grumman Corporation | Department of Defense | Research and development | $25.77M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ENGINEERING SERVICES TO ANALYZE, DESIGN, AND DEVELOP AN ENGINEERING EVALUATION… | “microelectronic” possibly only a mention |
| HR00112330002 | Srcco Inc. | Department of Defense | Grants and other assistance | $24.00M | PURPOSE OF THE DEPARTMENT OF DEFENSE INDUSTRY RESEARCH COLLABORATION IN THE JOINT UNIVERSITY MICROELECTRONICS PROGRAM 2.0 JUMP 2.0 THE JOINT UNIVERSITY MICROELECTRONICS PROGRAM 2.0 JUMP 2.0 WILL… | “microelectronics” |
| HQ072723F1421 | Northrop Grumman Corporation | Department of Defense | Research and development | $22.73M | DATA IAW TASK ORDERS: ANALYZE, DESIGN, DEVELOP, AND TEST ADVANCED TECHNOLOGY MICROELECTRONIC SOLUTIONS TO RESOLVE OBSOLESCENCE ISSUES IN THE B-2 OXYGEN GENERATING AND DISTRIBUTION SYSTEM | “microelectronic” |
| HQ072723F1413 | Northrop Grumman Corporation | Department of Defense | Maintenance, repair and field support | $22.26M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO IMPROVE THE AVAILABILITY OF THE MICROELECTRONICS-BASED AIR AND MISSILE DEFENSE… | “microelectronic” possibly only a mention |
| W912WJ22C0002 | Gilbane-Exyte a Joint Venture | Department of Defense | Other services | $20.61M | CONSTRUCTION OF ADVANCED COMPOUND SEMICONDUCTOR LABORATORY/MICROSYSTEM INTEGRATION FACILITY (CSL-MIF) HANSCOM AIR FORCE BASE, BEDFORD,MA | “semiconductor” possibly only a mention |
| FA807521F0005 | Booz Allen Hamilton Inc | Department of Defense | Research and development | $17.38M | MICROELECTRONICS ASSURANCE FOR SECURE TRUSTWORTHY ELECTRONICS RESEARCH (MASTER) | “microelectronics” |
| HQ072723F4100 | Globalfoundries U.S. 2 LLC | Department of Defense | Equipment and parts | $17.32M | THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION SPECIFIC INTEGRATED CIRCUITS (ASIC) | “foundry” |
| HQ072720C4000 | Marvell Government Solutions LLC | Department of Defense | Equipment and parts | $12.95M | AWARD SEPARATING ASIC SOW. | “product or program code” |
| HR00112130002 | Newport Fab, LLC | Department of Defense | Grants and other assistance | $10.84M | THE PURPOSE OF THIS AGREEMENT IS TO DEVELOP AN INTEGRATED PHOTONICS FOUNDRY CAPABILITY WHEREIN OPTICAL AMPLIFIERS AND LASERS ARE COMBINED WITH THE EXISTING SILICON PHOTONICS MANUFACTURING LINE OF… | “foundry” |
| FA830723FB033 | L3Harris Technologies, Inc | Department of Defense | Equipment and parts | $10.20M | ADVANCED EXTREMELY HIGH FREQUENCY COMMUNICATIONS SECURITY TRANSMISSION SECURITY SYSTEMS AND CRYPTOGRAPHIC CORE PROCESSOR APPLICATION SPECIFIC INTEGRATED CIRCUIT PRODUCTION - FISCAL YEAR 23 ORDER | “integrated circuit” |
| HQ072723F4000 | International Business Machines Corporation | Department of Defense | Engineering, technical and professional support | $9.63M | MARQUESAS RELOCATION DESIGN & INSTALLATION SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| FA865023C1000 | Battelle Memorial Institute | Department of Defense | Research and development | $9.48M | MICROELECTRONICS EMBEDDED SYSTEM AND ASSURANCE II | “microelectronics” |
| HQ072723F1613 | Raytheon Company | Department of Defense | Research and development | $9.27M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR RADAR ENHANCEMENTS FOR MANEUVER FORCE. | “microelectronic” possibly only a mention |
| HQ072720F1621 | Raytheon Company | Department of Defense | Research and development | $8.70M | ENGINEERING SERVICES - CET 20-051 MICROELECTRONIC AND SOFTWARE PROTOTYPE SOLUTIONS TO ADD NEW CAPABILITY AND IMPROVE PERFORMANCE OF THE MICROELECTRONICS-BASED WIDE AREA SEARCH&MULTI-MISSION SENSOR… | “microelectronic” possibly only a mention |
| DEEE0011003 | North Carolina State University | Department of Energy | Grants and other assistance | $8.25M | POWERAMERICA: A WIDE BANDGAP SEMICONDUCTOR MANUFACTURING INSTITUTE | “semiconductor” |
| HQ072723F0100 | Blackwatch International Corporation | Department of Defense | Maintenance, repair and field support | $7.27M | MANUFACTURING SUSTAINMENT AND ENGINEERING SUPPORT SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| FA865023C1001 | Riverside Research Institute | Department of Defense | Research and development | $6.92M | MICROELECTRONICS AND EMBEDDED SYSTEM ASSURANCE II | “microelectronics” |
| 1906325 | The Regents of the University of California | National Science Foundation | Grants and other assistance | $6.37M | ENABLING QUANTUM LEAP: Q-AMASE-I: QUANTUM FOUNDRY AT UCSB | “foundry” possibly only a mention |
| HQ072723F1418 | Northrop Grumman Corporation | Department of Defense | Research and development | $6.05M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY TO INTEGRATE, TEST AND PROTOTYPE ADVANCED TECHNOLOGY MICROELECTRONICS SCANNING AND SOFTWARE… | “microelectronic” possibly only a mention |
| HQ072723F1402 | Northrop Grumman Corporation | Department of Defense | Research and development | $5.63M | THE PURPOSE OF THIS TASK IS TO DEVELOP, INTEGRATE, AND TEST ADVANCED TECHNOLOGY MICROELECTRONICS SENSOR AND SOFTWARE SOLUTIONS TO ADD CAPABILITY, FROM TRANSLATION BASELINE, TO THE MICROELECTRONICS… | “microelectronics” possibly only a mention |
| HQ072723F1609 | Raytheon Company | Department of Defense | Research and development | $5.47M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR RADAR SURVIVABILITY THROUGH DISTRIBUTED SENSING. | “microelectronic” possibly only a mention |
| 1333ND23PNB100023 | Itc-De, LLC | Department of Commerce | Research and development | $4.92M | NIST CHIPS ACT FOR NATIONAL SEMICONDUCTOR TECHNOLOGY CENTER (NSTC) DESIGN STUDY | “chips act” |
| HQ072723C0012 | Microchip Technology Inc | Department of Defense | Engineering, technical and professional support | $4.82M | MITIGATING OBSOLESCENCE OF MIL-PRF-19500 TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| HQ072723F1617 | Raytheon Company | Department of Defense | Research and development | $4.74M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ANALYZE, DESIGN, PROTOTYPE, DEMONSTRATE, INTEGRATE, TEST, AND ENHANCE SYSTEM… | “microelectronic” possibly only a mention |
| HQ072723F1201 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Research and development | $4.50M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ANALYZE, AND DEVELOP THE NEXT GENERATION SIGNALS INTELLIGENCE. | “microelectronic” possibly only a mention |
| 1333ND23PNB130096 | RB Management Consultants II LLC | Department of Commerce | Engineering, technical and professional support | $4.50M | FOLLOW-ON SEMICONDUCTOR ANALYSIS, PROGRAM MANAGEMENT, AND CONTENT DEVELOPMENT SUPPORT | “semiconductor” possibly only a mention |
| 1333ND23PNB130002 | RB Management Consultants II LLC | Department of Commerce | Engineering, technical and professional support | $4.49M | SEMICONDUCTOR ANALYSIS, PROGRAM MANAGEMENTR, AND CONTENT DEVELOPMENT SUPPORT | “semiconductor” possibly only a mention |
| FA860620F0011 | Gentex Corporation | Department of Defense | Equipment and parts | $4.48M | ALEP BLOCK III DAY SPECTACLES | “product or program code” |
| 2329784 | University of Washington | National Science Foundation | Grants and other assistance | $4.00M | U.S.-JAPAN UNIVERSITY PARTNERSHIP FOR WORKFORCE ADVANCEMENT AND RESEARCH & DEVELOPMENT IN SEMICONDUCTORS (UPWARDS) FOR THE FUTURE -THE CHIPS AND SCIENCE ACT, SIGNED INTO LAW ON AUGUST 9, 2022,… | “semiconductors” |
| HR00112030002 | Globalfoundries U.S. Inc. | Department of Defense | Grants and other assistance | $3.99M | THE PURPOSE OF THIS AGREEMENT IS TO ADD FUNDING IN SUPPORT OF THE T-MUSIC PROGRAM'S ADVANCEMENT OF CMOS FOUNDRY TECHNOLOGY. | “foundry” |
| N000142312008 | University of Arkansas | Department of Defense | Grants and other assistance | $3.99M | SIGESNPB SEMICONDUCTOR FAB FOR ROOM TEMP ELECTRO-OPTIC INFRARED (IR) SENSORS | “semiconductor” |
| FA865023C7322 | Raytheon Company | Department of Defense | Research and development | $3.88M | NEXT GENERATION MICROELECTRONICS MANUFACTURING - THREE-DIMENSIONAL HETEROGENEOUS INTEGRATION FOR THREAT REDUCTION, INNOV | “microelectronics” |
| N000142312872 | University of Arkansas | Department of Defense | Grants and other assistance | $3.45M | SIGESNPB SEMICONDUCTOR FAB FOR ROOM TEMP ELECTRO-OPTIC INFRARED (IR) SENSORS - PHASE 2 | “semiconductor” |
| HQ072721C0006 | Blackwatch International Corporation | Department of Defense | Maintenance, repair and field support | $3.13M | MANUFACTURING SUSTAINMENT | “product or program code” |
| 2328217 | Arizona State University | National Science Foundation | Grants and other assistance | $3.00M | FMRG: BIO: MANUFACTURING ULTRA-HIGH-DENSITY DNA-ENABLED NANOELECTRONICS SYSTEMS -THE ABILITY TO DESIGN, MANUFACTURE, AND INTEGRATE SEMICONDUCTOR-BASED DEVICES LED TO THE INFORMATION TECHNOLOGY… | “semiconductor” possibly only a mention |
| 2328010 | Regents of the University of Michigan | National Science Foundation | Grants and other assistance | $3.00M | FMRG: CYBER: MANUFACTURING USA: MANUFACTURING OF NEXT-GENERATION PEROVSKITE SEMICONDUCTORS AT SCALE -FOR THE PAST CENTURY, SEMICONDUCTOR MANUFACTURING HAS RELIED HEAVILY ON SEQUENTIAL DEPOSITION AND… | “semiconductors” |
| P116Z230261 | University of Texas at Dallas | Department of Education | Grants and other assistance | $3.00M | NORTH TEXAS SEMICONDUCTOR WORKFORCE CONSORTIUM: AN INDUSTRY-BASED, WORKFORCE DEVELOPMENT ECOSYSTEM | “semiconductor” possibly only a mention |
| DESC0021118 | The Pennsylvania State University | Department of Energy | Grants and other assistance | $2.87M | CENTER FOR 3D FERROELECTRIC MICROELECTRONICS | “microelectronics” |
| FA865023C7320 | Northrop Grumman Corporation | Department of Defense | Research and development | $2.86M | NEXT GENERATION MICROELECTRONICS MANUFACTURING | “microelectronics” |
| FA865020C1911 | Icamr, Inc. | Department of Defense | Research and development | $2.81M | TRUSTED SEMICONDUCTOR MANUFACTURING PILOT PROJECT | “semiconductor” |
| 2301184 | The Research Foundation for the State University of New York | National Science Foundation | Grants and other assistance | $2.79M | NORTHEAST CONSORTIA FOR ADVANCED INTEGRATED SILICON TECHNOLOGIES -THE EXPANSION OF DATA NETWORKS AND CENTERS, SAFER AUTONOMOUS DRIVING VEHICLES, AND MORE EFFICIENT FOOD PRODUCTION CANNOT BE… | “integrated circuits” |
| H9240323F0057 | Sheaumann Laser, Inc. | Department of Defense | Equipment and parts | $2.77M | ILLUMINATE KIT | “product or program code” |
| 140D0423C0045 | Icamr, Inc. | Department of the Interior | Research and development | $2.75M | THE MICROSYSTEMS TECHNOLOGY OFFICE (MTO) AT DARPA WAS SEEKING INNOVATIVE PROPOSALS TO INFORM PLANNING FOR THE NEXT GENERATION MICROELECTRONICS MANUFACTURING (NGMM) PROGRAM. NGMM IS WORKING TO… | “microelectronics” |
| FA945323CA036 | Silicon Technologies Inc | Department of Defense | Research and development | $2.63M | ADVANCED ANALOG & MIXED SIGNAL RAD HARD MICROELECTRONICS DESIGN AND MANUFACTURING PROGRAM. | “microelectronics” |