Putting the topic page together from the records…
Putting the topic page together from the records…
The current fiscal year is still being reported (Defense contracts arrive about 90 days late).
Awards are tagged by words in their description; Jev (an AI that answers yes/no with a probability, not text) judged whether each of the 3,542 word-tagged awards is really about semiconductors and microelectronics and which kind. The numbers themselves come from the records. The largest left out:
Each award's description says which side it's on; its product or service code says what kind of purchase it is.
| Type | Kind of purchase | Obligations | Awards | Leading suppliers |
|---|---|---|---|---|
| Research and development | $936.25M | 183 | Raytheon Company · Northrop Grumman Corporation · Booz Allen Hamilton Inc | |
| Grants and other assistance | $366.55M | 573 | Greensource Fabrication LLC · Srcco Inc. · The Research Foundation for the State University of New York | |
| Equipment and parts | $337.36M | 3,589 | Bae Systems Information and Electronic Systems Integration Inc. · Globalfoundries U.S. 2 LLC · L3Harris Technologies, Inc | |
| Maintenance, repair and field support | $93.41M | 36 | Northrop Grumman Corporation · Lockheed Martin Corp · Blackwatch International Corporation | |
| Other services | $74.98M | 8 | Gilbane-Exyte a Joint Venture · Bright Silicon Technologies, Inc. · Fortis Native Group LLC | |
| Engineering, technical and professional support | $45.93M | 27 | International Business Machines Corporation · Amentum Services, Inc. · Precise Systems, Inc. | |
| IT and data | $505.0K | 3 | Bahfed Corp · Advanced Computer Concepts, Inc. · Sterling Computers Corporation |
Companies with semiconductors and microelectronics contracts, largest first (the top 30 of 732). Grants are listed below.
| Supplier | Obligations | Contracts | What | Buyers | Largest contract |
|---|---|---|---|---|---|
| Raytheon Company | $476.21M | 76 | Research and development · Equipment and parts | Department of Defense | HQ072724F1610 · $178.14M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE… |
| Northrop Grumman Corporation | $342.02M | 42 | Research and development · Maintenance, repair and field support | Department of Defense · Department of the Interior | HQ072724F1400 · $61.44M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE… |
| Bae Systems Information and Electronic Systems Integration Inc. | $98.29M | 2 | Equipment and parts | Department of Defense | FA880721C0003 · $97.70M · GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER… |
| Globalfoundries U.S. 2 LLC | $92.33M | 4 | Equipment and parts | Department of Defense | HQ072723F4100 · $51.06M · THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION… |
| Gilbane-Exyte a Joint Venture | $67.59M | 1 | Other services | Department of Defense | W912WJ22C0002 · $67.59M · CONSTRUCTION OF ADVANCED COMPOUND SEMICONDUCTOR LABORATORY/MICROSYSTEM INTEGRATION… |
Each opens its own page: every action, the terms, and who the money went to next. “Why here” is the word in its description that tagged it.
| Award | To | Agency | What | Obligations | Description | Why here |
|---|---|---|---|---|---|---|
| HQ072724F1610 | Raytheon Company | Department of Defense | Research and development | $178.14M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ADVANCED TECHNOLOGY MAINTAINABILITY OF THE MICROELECTRONICS-BASED COUNTER… | “microelectronic” possibly only a mention |
| HQ072724F1617 | Raytheon Company | Department of Defense | Research and development | $146.84M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO RESOLVE OBSOLESCENCE ISSUES, IMPROVE PERFORMANCE, IMPROVE RELIABILITY OF THE… | “microelectronic” |
| FA880721C0003 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Equipment and parts | $97.70M | GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER CARD PROGRAM WITH NEXT GENERATION APPLICATION SPECIFIC INTEGRATED CIRCUIT INCREMENT 2 | “integrated circuit” |
| W912WJ22C0002 | Gilbane-Exyte a Joint Venture | Department of Defense | Other services | $67.59M | CONSTRUCTION OF ADVANCED COMPOUND SEMICONDUCTOR LABORATORY/MICROSYSTEM INTEGRATION FACILITY (CSL-MIF) HANSCOM AIR FORCE BASE, BEDFORD,MA | “semiconductor” possibly only a mention |
How awards are tagged: their product or program code, or words in the award's original description (chips, CHIPS Act, semiconductor, microelectronics…), minus known noise. A description can mention the topic in passing, so check an award's own page. Source: USAspending.gov prime awards, FY2023 on; amounts are obligations (money committed), not outlays.
| Lockheed Martin Corp | $47.52M | 8 | Research and development · Maintenance, repair and field support | Department of Defense | HQ072724F1100 · $22.28M · CET 23-320, ANALYZE, DEVELOP AND INTEGRATE AN ADVANCED TECHNOLOGY MICROELECTRONIC PODDED… |
| L3Harris Technologies, Inc | $46.24M | 13 | Equipment and parts | Department of Defense | FA880721C0005 · $41.29M · GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER… |
| Booz Allen Hamilton Inc | $43.21M | 3 | Research and development · Equipment and parts | Department of Defense | FA807521F0005 · $43.14M · MICROELECTRONICS ASSURANCE FOR SECURE TRUSTWORTHY ELECTRONICS RESEARCH (MASTER) |
| International Business Machines Corporation | $40.94M | 7 | Engineering, technical and professional support | Department of Defense | HQ072724F4006 · $13.31M · SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR… |
| Amentum Services, Inc. | $34.30M | 2 | Research and development · Engineering, technical and professional support | Department of Defense | FA807524F0002 · $31.00M · MICROELECTRONICS FACILITIES AND LABORATORIES RESEARCH, DEVELOPMENT, TEST, AND EVALUATION… |
| Bae Systems Information and Electronic Systems Integration Inc. | $26.65M | 20 | Research and development · Equipment and parts | Department of Defense | HQ072723F1201 · $9.71M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE… |
| Nimbis Services Inc | $15.16M | 1 | Research and development | General Services Administration | 47QFLA22F0175 · $15.16M · QUANTIFIABLY ASSURED MICROELECTRONICS EMULATION ECOSYSTEM QAMEE |
| Battelle Memorial Institute | $9.86M | 3 | Research and development | Department of Defense | FA865023C1000 · $5.17M · MICROELECTRONICS EMBEDDED SYSTEM AND ASSURANCE II |
| Riverside Research Institute | $6.15M | 2 | Research and development | Department of Defense | FA865023C1001 · $6.34M · MICROELECTRONICS AND EMBEDDED SYSTEM ASSURANCE II |
| Canon U.S.A., Inc. | $5.25M | 1 | Equipment and parts | Department of Defense | HQ072724C1003 · $5.25M · WAFER I-STEPPER TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE,… |
| Jo-Kell Inc. | $4.69M | 89 | Equipment and parts | Department of Defense | N0010424CBA50 · $3.29M · UPS RECTIFIER |
| Blackwatch International Corporation | $4.36M | 2 | Maintenance, repair and field support | Department of Defense | HQ072723F0100 · $4.36M · MANUFACTURING SUSTAINMENT AND ENGINEERING SUPPORT SERVICES TO DESIGN, FABRICATE,… |
| Dynapower Company LLC | $4.24M | 1 | Equipment and parts | Department of Defense | W911PT24P0025 · $4.24M · TO COVER THE COST OF EXPEDITED MANUFACTURING & DELIVERY OF 2 EA SCR RECTIFIERS OF 5000… |
| General Micro Systems, Inc | $4.00M | 1 | Equipment and parts | Department of Defense | N0010424CDA17 · $4.00M · DISPLAY,OPTOELECTRO |
| Bright Silicon Technologies, Inc. | $3.70M | 1 | Other services | Department of Defense | FA873024PB008 · $3.70M · PRECISION ASSEMBLY OF LASER COMMUNICATION ARRAYS (PALCA) |
| Silicon Technologies Inc | $3.28M | 1 | Research and development | Department of Defense | FA945323CA036 · $3.28M · ADVANCED ANALOG & MIXED SIGNAL RAD HARD MICROELECTRONICS DESIGN AND MANUFACTURING PROGRAM. |
| Thales Defense & Security Inc | $3.18M | 1 | Equipment and parts | Department of Defense | N0038324CB026 · $3.18M · PROCESSOR,HELMET |
| Bogue Systems Inc | $3.14M | 9 | Equipment and parts | Department of Defense | N0010424CDA25 · $1.45M · ASSEMBLY,POWER MODU |
| Leidos Holdings, Inc. | $2.61M | 1 | Research and development | Department of Defense | FA945118C0014 · $2.61M · IGF::OT::IGF COMPACT SEMICONDUCTOR MID- AND LONG-WAVE OPTO-ELECTRONICS RESEARCH (COSMO) |
| Physical Sciences Inc. | $2.61M | 2 | Research and development | Department of Defense · National Aeronautics and Space Administration | FA237724CB034 · $1.76M · SEMICONDUCTOR PATTERNING FOR ANTI-REFLECTION |
| Cryptography Research, Inc | $2.00M | 1 | Equipment and parts | Department of Defense | FA237724CB017 · $2.00M · MICROELECTRONICS SUPPLY CHAIN SECURITY: NOVEL MECHANISMS FOR TRACEABILITY, THREAT… |
| United Semiconductors, LLC | $1.99M | 2 | Research and development | Department of Defense · National Aeronautics and Space Administration | FA239424CB021 · $1.25M · SBIR II - PRODUCTION OF ELECTRO-OPTICAL INFRARED GRADE LARGE DIAMETER BINARY AND TERNARY… |
| Centroid, Inc. | $1.98M | 24 | Equipment and parts | Department of Defense | SPE7MX24F0503 · $304.3K · 8510200595!SEMICONDUCTOR DEVIC |
| GE Energy Power Conversion USA Inc. | $1.98M | 1 | Equipment and parts | Department of Defense | N0010424PJB03 · $1.98M · MODULE,MACHINE BRID |
| Sitime Corporation | $1.97M | 1 | Research and development | Department of Defense | HQ072724C1002 · $1.97M · SBIR DIRECT TO PHASE II (24-4C9): HIGH PERFORMANCE CLOCK OSCILLATOR: RESEARCH AND… |
| HQ072724F1400 | Northrop Grumman Corporation | Department of Defense | Research and development | $61.44M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO IMPROVE PERFORMANCE, IMPROVE RELIABILITY AND MAINTAINABILITY OF THE… | “microelectronic” |
| HQ072724F1604 | Raytheon Company | Department of Defense | Research and development | $59.04M | ENGINEERING SERVICES: THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR RADAR. | “microelectronic” possibly only a mention |
| HQ072723F4100 | Globalfoundries U.S. 2 LLC | Department of Defense | Equipment and parts | $51.06M | THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION SPECIFIC INTEGRATED CIRCUITS (ASIC) | “foundry” |
| HQ072724F1408 | Northrop Grumman Corporation | Department of Defense | Research and development | $49.91M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ADD CAPABILITY, IMPROVE PERFORMANCE, AND INCREASE AVAILABILITY OF THE… | “microelectronic” possibly only a mention |
| FA86502425536 | Greensource Fabrication LLC | Department of Defense | Grants and other assistance | $46.17M | DPA TITLE III - STATE-OF-THE-ART ONSHORE ADVANCED PACKAGING PRODUCTION (SOAPP) | “advanced packaging” |
| FA807521F0005 | Booz Allen Hamilton Inc | Department of Defense | Research and development | $43.14M | MICROELECTRONICS ASSURANCE FOR SECURE TRUSTWORTHY ELECTRONICS RESEARCH (MASTER) | “microelectronics” |
| HQ072724F4100 | Globalfoundries U.S. 2 LLC | Department of Defense | Equipment and parts | $42.80M | THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION SPECIFIC INTEGRATED CIRCUITS (ASIC) | “foundry” |
| FA880721C0005 | L3Harris Technologies, Inc | Department of Defense | Equipment and parts | $41.29M | GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER CARD PROGRAM WITH NEXT GENERATION APPLICATION SPECIFIC INTEGRATED CIRCUIT INCREMENT | “integrated circuit” |
| HQ072724F1600 | Raytheon Company | Department of Defense | Research and development | $36.89M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR INTEGRATION, DELIVERY, AND TESTING OF THE MRIC PROTOTYPE SYSTEM | “microelectronic” possibly only a mention |
| HQ072724F1415 | Northrop Grumman Corporation | Department of Defense | Maintenance, repair and field support | $31.72M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR THE B-2 DATA ENTRY PANEL | “microelectronic” possibly only a mention |
| FA807524F0002 | Amentum Services, Inc. | Department of Defense | Research and development | $31.00M | MICROELECTRONICS FACILITIES AND LABORATORIES RESEARCH, DEVELOPMENT, TEST, AND EVALUATION FOR THE NAVAL SURFACE WARFARE CENTER CRANE STRATEGIC MICROELECTRONICS DIVISION AND THE NAVY STRATEGIC SYSTEMS… | “microelectronics” |
| HQ072724F1417 | Northrop Grumman Corporation | Department of Defense | Maintenance, repair and field support | $27.47M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO RESOLVE OBSOLESCENCE ISSUES OF THE MICROELECTRONICS-BASED B-2 BAND 1 RADIO… | “microelectronic” |
| HQ072724F1403 | Northrop Grumman Corporation | Department of Defense | Research and development | $27.04M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR AIRCRAFT ANTENNAS | “microelectronic” possibly only a mention |
| HR00112330002 | Srcco Inc. | Department of Defense | Grants and other assistance | $24.00M | PURPOSE OF THE DEPARTMENT OF DEFENSE INDUSTRY RESEARCH COLLABORATION IN THE JOINT UNIVERSITY MICROELECTRONICS PROGRAM 2.0 JUMP 2.0 THE JOINT UNIVERSITY MICROELECTRONICS PROGRAM 2.0 JUMP 2.0 WILL… | “microelectronics” |
| HQ072724F1100 | Lockheed Martin Corp | Department of Defense | Research and development | $22.28M | CET 23-320, ANALYZE, DEVELOP AND INTEGRATE AN ADVANCED TECHNOLOGY MICROELECTRONIC PODDED IRST SYSTEM SOLUTION TO ADD CAPABILITY TO THE MICROELECTRONICS-BASED F-16 FIGHTING FALCON. | “microelectronic” possibly only a mention |
| HQ072724F1410 | Northrop Grumman Corporation | Department of Defense | Maintenance, repair and field support | $21.76M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO IMPLEMENT THE NEXT ITERATION OF ANALYSIS AND UPDATE THE AIR AND MISSILE DEFENSE… | “microelectronic” possibly only a mention |
| HQ072724F1620 | Raytheon Company | Department of Defense | Research and development | $21.38M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONICS CAPABILITY SOLUTIONS FOR ENGINEERING SERVICES TO DESIGN, DEVELOP, TEST, AND INTEGRATE SOLUTIONS TO… | “microelectronics” possibly only a mention |
| HQ072724F1423 | Northrop Grumman Corporation | Department of Defense | Research and development | $19.32M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO IMPROVE PERFORMANCE OF THE MICROELECTRONICS-BASED INTERFACES TO SUPPORT… | “microelectronic” possibly only a mention |
| HQ072724F1405 | Northrop Grumman Corporation | Department of Defense | Research and development | $19.00M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ARMY INTEGRATED BATTLE COMMAND SYSTEM CAPABILITIES UPGRADE INCLUDING JOINT… | “microelectronic” possibly only a mention |
| 47QFLA22F0175 | Nimbis Services Inc | General Services Administration | Research and development | $15.16M | QUANTIFIABLY ASSURED MICROELECTRONICS EMULATION ECOSYSTEM QAMEE | “microelectronics” |
| 2315320 | Icamr, Inc. | National Science Foundation | Grants and other assistance | $14.94M | NSF ENGINES: CENTRAL FLORIDA SEMICONDUCTOR INNOVATION ENGINE -THIS NSF ENGINES AWARD TO THE CENTRAL FLORIDA SEMICONDUCTOR INNOVATION ENGINE WILL PLAY A CRITICAL ROLE IN BOLSTERING OUR NATION?S… | “semiconductor” |
| HQ072724F1418 | Northrop Grumman Corporation | Department of Defense | Research and development | $13.95M | THE AVANCED TECHNOLOGY SUPPORT PROGRAM ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR MICRO ELECTRONIC BASED MISSION PLANNING SYSTEMS | “microelectronic” possibly only a mention |
| SAQMIP24CA0028 | Arizona State University | Department of State | Grants and other assistance | $13.80M | BOLSTER SEMICONDUCTOR ASSEMBLY, TESTING, AND PACKAGING CAPABILITIES IN ITSI PARTNER COUNTRIES THROUGH REGULATORY REFORM AND WORKFORCE DEVELOPMENT INITIATIVES. SEMICONDUCTOR MANUFACTURERS. | “semiconductor” |
| HQ072724F1426 | Northrop Grumman Corporation | Department of Defense | Research and development | $13.61M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ADD CAPABILITY AND IMPROVE PERFORMANCE OF THE MICROELECTRONICS-BASED SCALED… | “microelectronic” |
| HQ072724F1105 | Lockheed Martin Corp | Department of Defense | Research and development | $13.61M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ADD CAPABILITY AND IMPROVE PERFORMANCE OF THE MICROELECTRONICS-BASED SCALED… | “microelectronic” |
| HQ072724F4006 | International Business Machines Corporation | Department of Defense | Engineering, technical and professional support | $13.31M | SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| HQ072724F1427 | Northrop Grumman Corporation | Department of Defense | Research and development | $12.98M | ENGINEERING SERVICES. THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR BQM-34S AVIONICS DMS UPDATE. | “microelectronic” possibly only a mention |
| ED24HDQ0G0409 | Centerstate Corporation for Economic Opportunity | Department of Commerce | Grants and other assistance | $12.00M | PURPOSE: THE NEW YORK SMART I-CORRIDOR SERVES TO USE A GOVERNANCE INFRASTRUCTURE THAT ENABLES GROWTH OF THE SEMICONDUCTOR CLUSTER THROUGH A VARIETY OF STAKEHOLDERS, INCLUDING LABOR, COMMUNITY-BASED… | “semiconductor” possibly only a mention |
| HQ072724F1419 | Northrop Grumman Corporation | Department of Defense | Research and development | $10.91M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR BASE OPERATION NETWORKS. | “microelectronic” possibly only a mention |
| ED24HDQ0G0496 | Syracuse University | Department of Commerce | Grants and other assistance | $10.00M | PURPOSE: CREATE AN INNOVATION ASSET AND INNOVATION EXPERTISE ENGAGEMENT NETWORK WITH SEMICONDUCTOR-RELEVANT FACILITIES AND EXPERTISE TO ENABLE SMALL AND MEDIUM SIZED FIRMS TO COLLABORATE WITH… | “semiconductor” possibly only a mention |
| HQ072723F1201 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Research and development | $9.71M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ANALYZE, AND DEVELOP THE NEXT GENERATION SIGNALS INTELLIGENCE. | “microelectronic” possibly only a mention |
| HQ072724F4002 | International Business Machines Corporation | Department of Defense | Engineering, technical and professional support | $9.13M | SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| ED24HDQ0G0500 | The State University of New York Downstate Health Sciences University | Department of Commerce | Grants and other assistance | $9.13M | PURPOSE: CENTRALIZE COORDINATION OF WORKFORCE EFFORTS IN THE NY SMART I-CORRIDOR AND ESTABLISH AN I-CORRIDOR INDUSTRY COUNCIL. HELP EMPLOYERS IN THE TECH HUB HIRE AND RETAIN TALENT TO BUILD A… | “semiconductor” possibly only a mention |
| SPE7LX24C0002 | Raytheon Company | Department of Defense | Equipment and parts | $8.98M | 8510711104!MICROCIRCUIT,DIGITA | “product or program code” |
| ED24HDQ0G0482 | The Research Foundation for the State University of New York | Department of Commerce | Grants and other assistance | $8.90M | PURPOSE: DEVELOP A SUPPLY CHAIN ACTIVATION NETWORK (SCAN). PERFORM SEMICONDUCTOR SUPPLY CHAIN ANALYTICS TO DETERMINE LOCAL CAPABILITIES AND NEEDS OF IN-REGION FABS AND SUPPLIERS. IDENTIFY… | “semiconductor” |
| HQ072724F1104 | Lockheed Martin Corp | Department of Defense | Maintenance, repair and field support | $8.36M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR MH-60R/S SECURE COMMUNICATIONS UPGRADE PROGRAM. NEW TASK ORDER AWARD. | “microelectronic” possibly only a mention |
| HQ072724F1412 | Northrop Grumman Corporation | Department of Defense | Research and development | $8.13M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ADDITIONAL NETWORK KITTING BASE OPERATIONS NETWORKS (SHANK-BONES). | “microelectronic” possibly only a mention |
| HQ072724F1603 | Raytheon Company | Department of Defense | Research and development | $6.61M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR SOFTWARE SOLUTIONS TO ADD CAPABILITY AND IMPROVE PERFORMANCE OF THE… | “microelectronic” possibly only a mention |
| FA865023C1001 | Riverside Research Institute | Department of Defense | Research and development | $6.34M | MICROELECTRONICS AND EMBEDDED SYSTEM ASSURANCE II | “microelectronics” |
| HQ072724F1413 | Northrop Grumman Corporation | Department of Defense | Research and development | $6.13M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR SUBMARINE TRAINER TECHNOLOGY REFRESH AND INSERTION (STTRI) FOR UPGRADES TO COMBA | “microelectronic” possibly only a mention |
| DEEE0011003 | North Carolina State University | Department of Energy | Grants and other assistance | $6.00M | POWERAMERICA: A WIDE BANDGAP SEMICONDUCTOR MANUFACTURING INSTITUTE | “semiconductor” |
| HQ072724F4001 | International Business Machines Corporation | Department of Defense | Engineering, technical and professional support | $5.84M | SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| HQ072724F1103 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Research and development | $5.82M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONICS CAPABILITY SOLUTIONS TO ADD CAPABILITY AND AVAILABILITY TO THE EXISTING DEPLOYED ASSET TRACKING SYSTEM | “microelectronics” possibly only a mention |
| HQ072724C1003 | Canon U.S.A., Inc. | Department of Defense | Equipment and parts | $5.25M | WAFER I-STEPPER TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND PROCURE MICROELECTRONICS AND/OR OPERATE SUCH A FACILITY. | “microelectronics” |
| HQ072723F1609 | Raytheon Company | Department of Defense | Research and development | $5.21M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR RADAR SURVIVABILITY THROUGH DISTRIBUTED SENSING. | “microelectronic” possibly only a mention |
| FA865023C1000 | Battelle Memorial Institute | Department of Defense | Research and development | $5.17M | MICROELECTRONICS EMBEDDED SYSTEM AND ASSURANCE II | “microelectronics” |