Putting the topic page together from the records…
Putting the topic page together from the records…
The current fiscal year is still being reported (Defense contracts arrive about 90 days late).
Awards are tagged by words in their description; Jev (an AI that answers yes/no with a probability, not text) judged whether each of the 3,542 word-tagged awards is really about semiconductors and microelectronics and which kind. The numbers themselves come from the records. The largest left out:
Each award's description says which side it's on; its product or service code says what kind of purchase it is.
| Type | Kind of purchase | Obligations | Awards | Leading suppliers |
|---|---|---|---|---|
| Research and development | $2.84B | 401 | Raytheon Company · Northrop Grumman Corporation · Lockheed Martin Corp | |
| Equipment and parts | $1.04B | 11,586 | Bae Systems Information and Electronic Systems Integration Inc. · Globalfoundries U.S. 2 LLC · L3Harris Technologies, Inc | |
| Grants and other assistance | $867.15M | 1,195 | Srcco Inc. · Greensource Fabrication LLC · University of Arkansas | |
| Engineering, technical and professional support | $246.82M | 49 | International Business Machines Corporation · Globalfoundries U.S. 2 LLC · Amentum Services, Inc. | |
| Maintenance, repair and field support | $237.98M | 69 | Northrop Grumman Corporation · Blackwatch International Corporation · Raytheon Company | |
| Other services | $111.33M | 14 | Gilbane-Exyte a Joint Venture · Fortis Native Group LLC · Bright Silicon Technologies, Inc. | |
| IT and data | $2.27M | 13 | Carahsoft Technology Corp · Prometheus Computing, LLC · Bahfed Corp |
Companies with semiconductors and microelectronics contracts, largest first (the top 30 of 1,295). Grants are listed below.
| Supplier | Obligations | Contracts | What | Buyers | Largest contract |
|---|---|---|---|---|---|
| Raytheon Company | $1.41B | 199 | Research and development · Equipment and parts | Department of Defense · National Aeronautics and Space Administration | HQ072725FE061 · $263.00M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE… |
| Northrop Grumman Corporation | $780.56M | 75 | Research and development · Maintenance, repair and field support | Department of Defense · Department of the Interior | HQ072724F1400 · $61.44M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE… |
| Globalfoundries U.S. 2 LLC | $360.71M | 10 | Equipment and parts · Engineering, technical and professional support | Department of Defense | HQ072723F4100 · $91.32M · THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION… |
| Bae Systems Information and Electronic Systems Integration Inc. | $246.53M | 5 | Equipment and parts | Department of Defense | FA880721C0003 · $243.94M · GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER… |
| Lockheed Martin Corp | $245.79M | 38 | Research and development · Maintenance, repair and field support | Department of Defense |
Each opens its own page: every action, the terms, and who the money went to next. “Why here” is the word in its description that tagged it.
| Award | To | Agency | What | Obligations | Description | Why here |
|---|---|---|---|---|---|---|
| HQ072725FE061 | Raytheon Company | Department of Defense | Research and development | $263.00M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR CONTINUED REFINEMENT, ENHANCEMENT, AND DELIVERY OF SENSE AND INTERCEPT EQUIPMENT | “microelectronic” possibly only a mention |
| FA880721C0003 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Equipment and parts | $243.94M | GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER CARD PROGRAM WITH NEXT GENERATION APPLICATION SPECIFIC INTEGRATED CIRCUIT INCREMENT 2 | “integrated circuit” |
| HQ072724F1610 | Raytheon Company | Department of Defense | Research and development | $216.90M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ADVANCED TECHNOLOGY MAINTAINABILITY OF THE MICROELECTRONICS-BASED COUNTER… | “microelectronic” possibly only a mention |
| FA880721C0005 | L3Harris Technologies, Inc | Department of Defense | Equipment and parts | $165.28M | GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER CARD PROGRAM WITH NEXT GENERATION APPLICATION SPECIFIC INTEGRATED CIRCUIT INCREMENT |
How awards are tagged: their product or program code, or words in the award's original description (chips, CHIPS Act, semiconductor, microelectronics…), minus known noise. A description can mention the topic in passing, so check an award's own page. Source: USAspending.gov prime awards, FY2023 on; amounts are obligations (money committed), not outlays.
| L3Harris Technologies, Inc | $191.69M | 28 | Equipment and parts · Research and development | Department of Defense | FA880721C0005 · $165.28M · GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER… |
| Amentum Services, Inc. | $150.92M | 3 | Research and development · Engineering, technical and professional support | Department of Defense | FA807524F0002 · $134.16M · MICROELECTRONICS FACILITIES AND LABORATORIES RESEARCH, DEVELOPMENT, TEST, AND EVALUATION… |
| Bae Systems Information and Electronic Systems Integration Inc. | $147.73M | 42 | Research and development · Maintenance, repair and field support | Department of Defense | HQ072723F1201 · $38.36M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE… |
| International Business Machines Corporation | $122.49M | 9 | Engineering, technical and professional support · Equipment and parts | Department of Defense · Department of Commerce | HQ072724F4006 · $32.30M · SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR… |
| Booz Allen Hamilton Inc | $103.91M | 4 | Research and development · Equipment and parts | Department of Defense | FA807521F0005 · $80.13M · MICROELECTRONICS ASSURANCE FOR SECURE TRUSTWORTHY ELECTRONICS RESEARCH (MASTER) |
| Gilbane-Exyte a Joint Venture | $94.16M | 1 | Other services | Department of Defense | W912WJ22C0002 · $94.16M · CONSTRUCTION OF ADVANCED COMPOUND SEMICONDUCTOR LABORATORY/MICROSYSTEM INTEGRATION… |
| Battelle Memorial Institute | $42.12M | 5 | Research and development | Department of Defense | FA865023C1000 · $24.27M · MICROELECTRONICS EMBEDDED SYSTEM AND ASSURANCE II |
| Blackwatch International Corporation | $31.32M | 3 | Maintenance, repair and field support | Department of Defense | HQ072723F0100 · $28.19M · MANUFACTURING SUSTAINMENT AND ENGINEERING SUPPORT SERVICES TO DESIGN, FABRICATE,… |
| Riverside Research Institute | $30.66M | 4 | Research and development | Department of Defense | FA865023C1001 · $30.85M · MICROELECTRONICS AND EMBEDDED SYSTEM ASSURANCE II |
| Nimbis Services Inc | $30.15M | 1 | Research and development | General Services Administration | 47QFLA22F0175 · $30.15M · QUANTIFIABLY ASSURED MICROELECTRONICS EMULATION ECOSYSTEM QAMEE |
| Gentex Corporation | $17.63M | 8 | Equipment and parts | Department of Defense | FA860624FB004 · $9.95M · AIRCREW LASER EYE PROTECTION (ALEP) NIGHT SPECTACLES DELIVERY ORDER |
| Electric Boat Corporation | $13.11M | 12 | Research and development · Equipment and parts | Department of Defense | HQ072725FE003 · $9.24M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE… |
| Marvell Government Solutions LLC | $12.95M | 1 | Equipment and parts | Department of Defense | HQ072720C4000 · $12.95M · AWARD SEPARATING ASIC SOW. |
| Honeywell International Inc. | $12.32M | 3 | Research and development | Department of Defense | HQ072725FE068 · $12.36M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE… |
| Auburn University | $11.47M | 2 | Research and development | Department of Defense · National Aeronautics and Space Administration | HQ086025C6001 · $11.40M · RADIATION HARDENED MICROELECTRONICS TESTING FACILITY |
| Silicon Technologies Inc | $10.69M | 1 | Research and development | Department of Defense | FA945323CA036 · $10.69M · ADVANCED ANALOG & MIXED SIGNAL RAD HARD MICROELECTRONICS DESIGN AND MANUFACTURING PROGRAM. |
| The Pennsylvania State University | $9.74M | 2 | Research and development | Department of the Interior · Department of Defense | 140D0424C0065 · $6.30M · LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING… |
| Fortis Native Group LLC | $9.53M | 1 | Other services | Department of Defense | HQ072723F0500 · $9.53M · PREVENTATIVE MAINTENANCE SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE,… |
| RB Management Consultants II LLC | $8.98M | 2 | Engineering, technical and professional support | Department of Commerce | 1333ND23PNB130002 · $4.49M · SEMICONDUCTOR ANALYSIS, PROGRAM MANAGEMENTR, AND CONTENT DEVELOPMENT SUPPORT |
| Jo-Kell Inc. | $8.36M | 293 | Equipment and parts | Department of Defense | N0010424CBA50 · $3.29M · UPS RECTIFIER |
| Bogue Systems Inc | $7.92M | 18 | Equipment and parts | Department of Defense | N0010425CDA08 · $2.00M · ASSEMBLY,POWER MODU |
| The Boeing Company | $7.76M | 27 | Research and development · Equipment and parts | Department of Defense | HQ072726FE004 · $2.63M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE… |
| General Micro Systems, Inc | $7.56M | 2 | Equipment and parts | Department of Defense | N0010424CDA17 · $4.00M · DISPLAY,OPTOELECTRO |
| Icamr, Inc. | $7.17M | 2 | Research and development | Department of Defense · Department of the Interior | FA865020C1911 · $4.61M · TRUSTED SEMICONDUCTOR MANUFACTURING PILOT PROJECT |
| Leidos Holdings, Inc. | $6.99M | 4 | Research and development · Equipment and parts | Department of Defense | FA945118C0014 · $6.98M · IGF::OT::IGF COMPACT SEMICONDUCTOR MID- AND LONG-WAVE OPTO-ELECTRONICS RESEARCH (COSMO) |
| “integrated circuit” |
| HQ072723F1614 | Raytheon Company | Department of Defense | Research and development | $158.96M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ANALYZE, DESIGN, DEVELOP, PROTOTYPE, PROCURE AND DEPLOY OPERATIONAL ENHANCEMENTS… | “microelectronic” possibly only a mention |
| HQ072724F1617 | Raytheon Company | Department of Defense | Research and development | $146.84M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO RESOLVE OBSOLESCENCE ISSUES, IMPROVE PERFORMANCE, IMPROVE RELIABILITY OF THE… | “microelectronic” |
| FA807524F0002 | Amentum Services, Inc. | Department of Defense | Research and development | $134.16M | MICROELECTRONICS FACILITIES AND LABORATORIES RESEARCH, DEVELOPMENT, TEST, AND EVALUATION FOR THE NAVAL SURFACE WARFARE CENTER CRANE STRATEGIC MICROELECTRONICS DIVISION AND THE NAVY STRATEGIC SYSTEMS… | “microelectronics” |
| HR00112330002 | Srcco Inc. | Department of Defense | Grants and other assistance | $96.67M | PURPOSE OF THE DEPARTMENT OF DEFENSE INDUSTRY RESEARCH COLLABORATION IN THE JOINT UNIVERSITY MICROELECTRONICS PROGRAM 2.0 JUMP 2.0 THE JOINT UNIVERSITY MICROELECTRONICS PROGRAM 2.0 JUMP 2.0 WILL… | “microelectronics” |
| W912WJ22C0002 | Gilbane-Exyte a Joint Venture | Department of Defense | Other services | $94.16M | CONSTRUCTION OF ADVANCED COMPOUND SEMICONDUCTOR LABORATORY/MICROSYSTEM INTEGRATION FACILITY (CSL-MIF) HANSCOM AIR FORCE BASE, BEDFORD,MA | “semiconductor” possibly only a mention |
| HQ072723F4100 | Globalfoundries U.S. 2 LLC | Department of Defense | Equipment and parts | $91.32M | THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION SPECIFIC INTEGRATED CIRCUITS (ASIC) | “foundry” |
| HQ072725FE077 | Raytheon Company | Department of Defense | Research and development | $90.68M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR MOBILE OBSOLESCENCE AND PRODUCTION READINESS | “microelectronic” |
| HQ072716C0001 | Globalfoundries U.S. 2 LLC | Department of Defense | Equipment and parts | $80.40M | TRUSTED FOUNDRY ACCESS 2 - AWARD OF BASE TRANSITION CONTRACT WITH DMEA. CONTRACT TRANSFERRED FROM NSA. | “foundry” |
| FA807521F0005 | Booz Allen Hamilton Inc | Department of Defense | Research and development | $80.13M | MICROELECTRONICS ASSURANCE FOR SECURE TRUSTWORTHY ELECTRONICS RESEARCH (MASTER) | “microelectronics” |
| FA880721C0006 | Raytheon Company | Department of Defense | Equipment and parts | $67.85M | GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER CARD PROGRAM WITH NEXT GENERATION APPLICATION SPECIFIC INTEGRATED CIRCUIT INCREMENT 2 | “integrated circuit” |
| HQ072725FE022 | Globalfoundries U.S. 2 LLC | Department of Defense | Engineering, technical and professional support | $65.08M | THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION SPECIFIC INTEGRATED CIRCUITS. (ASIC) | “foundry” |
| HQ072724F1400 | Northrop Grumman Corporation | Department of Defense | Research and development | $61.44M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO IMPROVE PERFORMANCE, IMPROVE RELIABILITY AND MAINTAINABILITY OF THE… | “microelectronic” |
| HQ072724F1604 | Raytheon Company | Department of Defense | Research and development | $59.04M | ENGINEERING SERVICES: THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR RADAR. | “microelectronic” possibly only a mention |
| HQ072723F1606 | Raytheon Company | Department of Defense | Research and development | $51.29M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR DESIGN, DEVELOPMENT AND OPERATIONAL ENHANCEMENTS FOR THE SENSE & WARN AND… | “microelectronic” possibly only a mention |
| HQ072724F4100 | Globalfoundries U.S. 2 LLC | Department of Defense | Equipment and parts | $50.59M | THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION SPECIFIC INTEGRATED CIRCUITS (ASIC) | “foundry” |
| HQ072724F1408 | Northrop Grumman Corporation | Department of Defense | Research and development | $49.91M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ADD CAPABILITY, IMPROVE PERFORMANCE, AND INCREASE AVAILABILITY OF THE… | “microelectronic” possibly only a mention |
| HQ072726FE030 | Raytheon Company | Department of Defense | Research and development | $48.00M | CET, 26-600: THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR THE MICROELECTRONICS-BASED LEX SYSTEM ON A DOD PLATFORM. | “microelectronic” possibly only a mention |
| FA86502425536 | Greensource Fabrication LLC | Department of Defense | Grants and other assistance | $46.17M | DPA TITLE III - STATE-OF-THE-ART ONSHORE ADVANCED PACKAGING PRODUCTION (SOAPP) | “advanced packaging” |
| HQ072726FE050 | Northrop Grumman Corporation | Department of Defense | Research and development | $45.58M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO RESOLVE OBSOLESCENCE ISSUES AND ADD CAPABILITY TO MICROELECTRONICS-BASED… | “microelectronic” |
| HQ072725FE023 | Northrop Grumman Corporation | Department of Defense | Research and development | $45.13M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ADD CAPABILITY, IMPROVE PERFORMANCE, RELIABILITY, MAINTAINABILITY OF A… | “microelectronic” possibly only a mention |
| HQ072724F1426 | Northrop Grumman Corporation | Department of Defense | Research and development | $44.86M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ADD CAPABILITY AND IMPROVE PERFORMANCE OF THE MICROELECTRONICS-BASED SCALED… | “microelectronic” |
| HQ072724F1405 | Northrop Grumman Corporation | Department of Defense | Research and development | $40.49M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ARMY INTEGRATED BATTLE COMMAND SYSTEM CAPABILITIES UPGRADE INCLUDING JOINT… | “microelectronic” possibly only a mention |
| HQ072724F1600 | Raytheon Company | Department of Defense | Research and development | $38.52M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR INTEGRATION, DELIVERY, AND TESTING OF THE MRIC PROTOTYPE SYSTEM | “microelectronic” possibly only a mention |
| HQ072723F1201 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Research and development | $38.36M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ANALYZE, AND DEVELOP THE NEXT GENERATION SIGNALS INTELLIGENCE. | “microelectronic” possibly only a mention |
| HQ072726FE066 | Raytheon Company | Department of Defense | Research and development | $32.42M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR (RECOMMEND USING THE TASK DESCRIPTION IN THE CET, 26-626. | “microelectronic” |
| HQ072724F4006 | International Business Machines Corporation | Department of Defense | Engineering, technical and professional support | $32.30M | SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| HQ072724F1421 | Northrop Grumman Corporation | Department of Defense | Research and development | $31.95M | ENGINEERING SERVICES- THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR MULTI-MISSION DRY SUBMERSIBLE, HOST CONVERSION. | “microelectronic” possibly only a mention |
| HQ072724F1415 | Northrop Grumman Corporation | Department of Defense | Maintenance, repair and field support | $31.72M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR THE B-2 DATA ENTRY PANEL | “microelectronic” possibly only a mention |
| FA865023C1001 | Riverside Research Institute | Department of Defense | Research and development | $30.85M | MICROELECTRONICS AND EMBEDDED SYSTEM ASSURANCE II | “microelectronics” |
| HQ072726FE049 | Northrop Grumman Corporation | Department of Defense | Research and development | $30.39M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO BUILD, AND TEST ADVANCED TECHNOLOGY MICROELECTRONIC SOLUTIONS TO IMPROVE THE… | “microelectronic” possibly only a mention |
| HQ072723F1410 | Northrop Grumman Corporation | Department of Defense | Research and development | $30.27M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ENGINEERING SERVICES TO ANALYZE, DESIGN, AND DEVELOP AN ENGINEERING EVALUATION… | “microelectronic” possibly only a mention |
| 47QFLA22F0175 | Nimbis Services Inc | General Services Administration | Research and development | $30.15M | QUANTIFIABLY ASSURED MICROELECTRONICS EMULATION ECOSYSTEM QAMEE | “microelectronics” |
| HQ072725FE031 | Globalfoundries U.S. 2 LLC | Department of Defense | Research and development | $30.15M | SOW 25-5C9 | “product or program code” |
| HQ072724F4002 | International Business Machines Corporation | Department of Defense | Engineering, technical and professional support | $30.02M | SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| HQ072724F1100 | Lockheed Martin Corp | Department of Defense | Research and development | $29.95M | CET 23-320, ANALYZE, DEVELOP AND INTEGRATE AN ADVANCED TECHNOLOGY MICROELECTRONIC PODDED IRST SYSTEM SOLUTION TO ADD CAPABILITY TO THE MICROELECTRONICS-BASED F-16 FIGHTING FALCON. | “microelectronic” possibly only a mention |
| 2315320 | Icamr, Inc. | National Science Foundation | Grants and other assistance | $29.94M | NSF ENGINES: CENTRAL FLORIDA SEMICONDUCTOR INNOVATION ENGINE -THIS NSF ENGINES AWARD TO THE CENTRAL FLORIDA SEMICONDUCTOR INNOVATION ENGINE WILL PLAY A CRITICAL ROLE IN BOLSTERING OUR NATION?S… | “semiconductor” |
| HQ072726FE007 | Lockheed Martin Corp | Department of Defense | Research and development | $29.16M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR F-35 GAP ANALYSIS AND TEST OPTIMIZATION (GATO). | “microelectronic” possibly only a mention |
| HQ072723F0100 | Blackwatch International Corporation | Department of Defense | Maintenance, repair and field support | $28.19M | MANUFACTURING SUSTAINMENT AND ENGINEERING SUPPORT SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| HQ072724F1417 | Northrop Grumman Corporation | Department of Defense | Maintenance, repair and field support | $27.47M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO RESOLVE OBSOLESCENCE ISSUES OF THE MICROELECTRONICS-BASED B-2 BAND 1 RADIO… | “microelectronic” |
| HQ072725FE037 | Lockheed Martin Corp | Department of Defense | Research and development | $27.11M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR HAMMER. | “microelectronic” possibly only a mention |
| HQ072724F1403 | Northrop Grumman Corporation | Department of Defense | Research and development | $27.04M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR AIRCRAFT ANTENNAS | “microelectronic” possibly only a mention |
| FA807525F0044 | Booz Allen Hamilton Inc | Department of Defense | Research and development | $26.87M | DEVELOPMENT OF RESILIENT AND ASSURED MICROELECTRONICS FOR AIR FORCE RESEARCH LABORATORY RESILIENT AND ASSURED MICROELECTRONICS BRANCH | “microelectronics” |
| HQ072726FE051 | Globalfoundries U.S. 2 LLC | Department of Defense | Engineering, technical and professional support | $26.48M | THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION SPECIFIC INTEGRATED CIRCUITS. (ASIC) | “foundry” |
| HQ072724F1105 | Lockheed Martin Corp | Department of Defense | Research and development | $24.96M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ADD CAPABILITY AND IMPROVE PERFORMANCE OF THE MICROELECTRONICS-BASED SCALED… | “microelectronic” |
| FA865023C1000 | Battelle Memorial Institute | Department of Defense | Research and development | $24.27M | MICROELECTRONICS EMBEDDED SYSTEM AND ASSURANCE II | “microelectronics” |
| HQ072723F1421 | Northrop Grumman Corporation | Department of Defense | Research and development | $22.73M | DATA IAW TASK ORDERS: ANALYZE, DESIGN, DEVELOP, AND TEST ADVANCED TECHNOLOGY MICROELECTRONIC SOLUTIONS TO RESOLVE OBSOLESCENCE ISSUES IN THE B-2 OXYGEN GENERATING AND DISTRIBUTION SYSTEM | “microelectronic” |