Putting the topic page together from the records…
Putting the topic page together from the records…
The current fiscal year is still being reported (Defense contracts arrive about 90 days late).
Awards are tagged by words in their description; Jev (an AI that answers yes/no with a probability, not text) judged whether each of the 3,542 word-tagged awards is really about semiconductors and microelectronics and which kind. The numbers themselves come from the records. The largest left out:
Each award's description says which side it's on; its product or service code says what kind of purchase it is.
| Type | Kind of purchase | Obligations | Awards | Leading suppliers |
|---|---|---|---|---|
| Research and development | $518.39M | 177 | Northrop Grumman Corporation · Raytheon Company · Lockheed Martin Corp | |
| Equipment and parts | $113.18M | 2,220 | L3Harris Technologies, Inc · Bae Systems Information and Electronic Systems Integration Inc. · Gentex Corporation | |
| Engineering, technical and professional support | $97.70M | 20 | Globalfoundries U.S. 2 LLC · International Business Machines Corporation · Amentum Services, Inc. | |
| Grants and other assistance | $91.93M | 359 | Srcco Inc. · Icamr, Inc. · University of Arkansas | |
| Maintenance, repair and field support | $29.50M | 28 | Raytheon Company · Blackwatch International Corporation · Northrop Grumman Corporation | |
| Other services | $4.92M | 6 | Fortis Native Group LLC · Gilbane-Exyte a Joint Venture · Wiley Wilson Burns & Mcdonnell Joint Venture | |
| IT and data | $647.3K | 5 | Carahsoft Technology Corp · Prometheus Computing, LLC · Singular Photonics Limited |
Companies with semiconductors and microelectronics contracts, largest first (the top 30 of 551). Grants are listed below.
| Supplier | Obligations | Contracts | What | Buyers | Largest contract |
|---|---|---|---|---|---|
| Northrop Grumman Corporation | $167.70M | 35 | Research and development · Maintenance, repair and field support | Department of Defense · Department of the Interior | HQ072726FE050 · $45.58M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE… |
| Raytheon Company | $144.38M | 50 | Research and development · Maintenance, repair and field support | Department of Defense · National Aeronautics and Space Administration | HQ072726FE030 · $48.00M · CET, 26-600: THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES… |
| Globalfoundries U.S. 2 LLC | $87.51M | 8 | Engineering, technical and professional support · Research and development | Department of Defense | HQ072725FE022 · $27.59M · THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION… |
| Lockheed Martin Corp | $69.54M | 23 | Research and development · Equipment and parts | Department of Defense | HQ072726FE007 · $29.16M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE… |
| Amentum Services, Inc. | $48.31M | 2 | Research and development · Engineering, technical and professional support | Department of Defense |
Each opens its own page: every action, the terms, and who the money went to next. “Why here” is the word in its description that tagged it.
| Award | To | Agency | What | Obligations | Description | Why here |
|---|---|---|---|---|---|---|
| HQ072726FE030 | Raytheon Company | Department of Defense | Research and development | $48.00M | CET, 26-600: THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR THE MICROELECTRONICS-BASED LEX SYSTEM ON A DOD PLATFORM. | “microelectronic” possibly only a mention |
| HQ072726FE050 | Northrop Grumman Corporation | Department of Defense | Research and development | $45.58M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO RESOLVE OBSOLESCENCE ISSUES AND ADD CAPABILITY TO MICROELECTRONICS-BASED… | “microelectronic” |
| FA880721C0005 | L3Harris Technologies, Inc | Department of Defense | Equipment and parts | $42.84M | GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER CARD PROGRAM WITH NEXT GENERATION APPLICATION SPECIFIC INTEGRATED CIRCUIT INCREMENT | “integrated circuit” |
| FA807524F0002 | Amentum Services, Inc. | Department of Defense | Research and development | $39.98M | MICROELECTRONICS FACILITIES AND LABORATORIES RESEARCH, DEVELOPMENT, TEST, AND EVALUATION FOR THE NAVAL SURFACE WARFARE CENTER CRANE STRATEGIC MICROELECTRONICS DIVISION AND THE NAVY STRATEGIC SYSTEMS… | “microelectronics” |
How awards are tagged: their product or program code, or words in the award's original description (chips, CHIPS Act, semiconductor, microelectronics…), minus known noise. A description can mention the topic in passing, so check an award's own page. Source: USAspending.gov prime awards, FY2023 on; amounts are obligations (money committed), not outlays.
| L3Harris Technologies, Inc | $42.60M | 8 | Equipment and parts · Research and development | Department of Defense | FA880721C0005 · $42.84M · GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER… |
| International Business Machines Corporation | $34.70M | 7 | Engineering, technical and professional support | Department of Defense | HQ072724F4002 · $10.61M · SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR… |
| Bae Systems Information and Electronic Systems Integration Inc. | $26.23M | 17 | Research and development | Department of Defense | HQ072723F1201 · $12.03M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE… |
| Booz Allen Hamilton Inc | $20.29M | 3 | Research and development | Department of Defense | FA807525F0044 · $20.44M · DEVELOPMENT OF RESILIENT AND ASSURED MICROELECTRONICS FOR AIR FORCE RESEARCH LABORATORY… |
| Bae Systems Information and Electronic Systems Integration Inc. | $15.42M | 3 | Equipment and parts | Department of Defense | FA880721C0003 · $14.68M · GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER… |
| Gentex Corporation | $8.91M | 3 | Equipment and parts | Department of Defense | FA860624FB004 · $8.31M · AIRCREW LASER EYE PROTECTION (ALEP) NIGHT SPECTACLES DELIVERY ORDER |
| Riverside Research Institute | $8.32M | 1 | Research and development | Department of Defense | FA865023C1001 · $8.32M · MICROELECTRONICS AND EMBEDDED SYSTEM ASSURANCE II |
| Blackwatch International Corporation | $7.61M | 2 | Maintenance, repair and field support | Department of Defense | HQ072723F0100 · $7.61M · MANUFACTURING SUSTAINMENT AND ENGINEERING SUPPORT SERVICES TO DESIGN, FABRICATE,… |
| Battelle Memorial Institute | $5.36M | 4 | Research and development | Department of Defense | FA865023C1000 · $5.01M · MICROELECTRONICS EMBEDDED SYSTEM AND ASSURANCE II |
| The Pennsylvania State University | $5.11M | 2 | Research and development | Department of the Interior · Department of Defense | 140D0424C0065 · $3.04M · LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING… |
| The Boeing Company | $4.06M | 9 | Research and development · Equipment and parts | Department of Defense | HQ072726FE004 · $2.63M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE… |
| Triman Industries Inc | $3.23M | 31 | Equipment and parts | Department of Defense | SPE7M526C0001 · $1.22M · 8511843326!MICROCIRCUIT,LINEAR |
| Aeluma, Inc. | $2.80M | 2 | Research and development | Department of Defense · National Aeronautics and Space Administration | W5170126CA163 · $1.95M · SMALL BUSINESS INNOVATION RESEARCH PHASE 2, TOPIC OSD232-003. PROPOSAL O2-2091:… |
| Fortis Native Group LLC | $2.75M | 1 | Other services | Department of Defense | HQ072723F0500 · $2.75M · PREVENTATIVE MAINTENANCE SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE,… |
| Gilbane-Exyte a Joint Venture | $2.12M | 1 | Other services | Department of Defense | W912WJ22C0002 · $2.12M · CONSTRUCTION OF ADVANCED COMPOUND SEMICONDUCTOR LABORATORY/MICROSYSTEM INTEGRATION… |
| Beacon Photonics Inc | $2.09M | 1 | Research and development | Department of Defense | W5170126CA099 · $2.09M · DEVELOP A MODE LOCKED LASER ON CHIP THAT WILL COMBINE THE ROBUSTNESS OF THE FIBER LASER… |
| Sigray, Inc. | $2.05M | 1 | Equipment and parts | Department of Commerce | 1333ND26PNB030089 · $2.05M · OU03-25-NEW-150 CHIPS R&D HIGH-THROUGHPUT HIGH-RESOLUTION X-RAY LAMINOGRAPHY/TOMOGRAPHY… |
| Chiplytics, Inc | $1.98M | 1 | Research and development | General Services Administration | 47QFLA26C0001 · $1.98M · CONTRACT AWARD_AUTOMATED INSPECTION FOR UNPRECEDENTED VISIBILITY INTO THE… |
| Lintech Components Co. Inc. | $1.96M | 218 | Equipment and parts | Department of Defense | SPE7M026P0777 · $150.6K · 8511780766!MICROCIRCUIT,LINEAR |
| Aerocyonics, Inc. | $1.78M | 1 | Research and development | Department of Defense | HQ086026CE008 · $1.78M · ULTRASHORT PULSE LASER PROCESSING FOR DECAPSULATION AND SAMPLE PREPARATION OF… |
| Signalscape Inc | $1.69M | 1 | Research and development | Department of Defense | HDTRA125FE061 · $1.69M · RESEARCH, DEVELOPMENT, TECHNICAL ANALYSIS, PROTOTYPING, AND FABRICATION OF INTEGRATED… |
| Nexus Photonics, Inc. | $1.65M | 1 | Research and development | Department of Defense | W5170126CA112 · $1.65M · DEVELOP AN APPLICATION-SPECIFIC PHOTONIC INTEGRATED CIRCUIT TO SERVE A SPECIFIC QUANTUM… |
| Jo-Kell Inc. | $1.51M | 52 | Equipment and parts | Department of Defense | SPE7M226V3584 · $290.1K · 8512121748!HEATER,THERMAL RELE |
| Taumat LLC | $1.45M | 1 | Research and development | Department of the Interior | 140D0426C0040 · $1.45M · THERMAL CORRALLING, ABSORPTION, AND HARVESTING IN HIGH POWER MICROELECTRONICS |
| Leidos Holdings, Inc. | $1.42M | 4 | Research and development · Equipment and parts | Department of Defense | FA945118C0014 · $1.41M · IGF::OT::IGF COMPACT SEMICONDUCTOR MID- AND LONG-WAVE OPTO-ELECTRONICS RESEARCH (COSMO) |
| HQ072726FE066 |
| Raytheon Company |
| Department of Defense |
| Research and development |
| $32.42M |
| THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR (RECOMMEND USING THE TASK DESCRIPTION IN THE CET, 26-626. |
| “microelectronic” |
| HQ072726FE049 | Northrop Grumman Corporation | Department of Defense | Research and development | $30.39M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO BUILD, AND TEST ADVANCED TECHNOLOGY MICROELECTRONIC SOLUTIONS TO IMPROVE THE… | “microelectronic” possibly only a mention |
| HQ072726FE007 | Lockheed Martin Corp | Department of Defense | Research and development | $29.16M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR F-35 GAP ANALYSIS AND TEST OPTIMIZATION (GATO). | “microelectronic” possibly only a mention |
| HQ072725FE022 | Globalfoundries U.S. 2 LLC | Department of Defense | Engineering, technical and professional support | $27.59M | THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION SPECIFIC INTEGRATED CIRCUITS. (ASIC) | “foundry” |
| HQ072726FE051 | Globalfoundries U.S. 2 LLC | Department of Defense | Engineering, technical and professional support | $26.48M | THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION SPECIFIC INTEGRATED CIRCUITS. (ASIC) | “foundry” |
| HR00112330002 | Srcco Inc. | Department of Defense | Grants and other assistance | $24.67M | PURPOSE OF THE DEPARTMENT OF DEFENSE INDUSTRY RESEARCH COLLABORATION IN THE JOINT UNIVERSITY MICROELECTRONICS PROGRAM 2.0 JUMP 2.0 THE JOINT UNIVERSITY MICROELECTRONICS PROGRAM 2.0 JUMP 2.0 WILL… | “microelectronics” |
| HQ072725FE031 | Globalfoundries U.S. 2 LLC | Department of Defense | Research and development | $22.06M | SOW 25-5C9 | “product or program code” |
| FA807525F0044 | Booz Allen Hamilton Inc | Department of Defense | Research and development | $20.44M | DEVELOPMENT OF RESILIENT AND ASSURED MICROELECTRONICS FOR AIR FORCE RESEARCH LABORATORY RESILIENT AND ASSURED MICROELECTRONICS BRANCH | “microelectronics” |
| HQ072724F1426 | Northrop Grumman Corporation | Department of Defense | Research and development | $20.05M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ADD CAPABILITY AND IMPROVE PERFORMANCE OF THE MICROELECTRONICS-BASED SCALED… | “microelectronic” |
| HQ072726FE036 | Raytheon Company | Department of Defense | Maintenance, repair and field support | $17.48M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO PRODUCE ADVANCED TECHNOLOGY AND SOLUTIONS TO ADD CAPABILITY AND INCREASE… | “microelectronic” possibly only a mention |
| HQ072725FE073 | Lockheed Martin Corp | Department of Defense | Research and development | $17.38M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR STORMBREAKER. | “microelectronic” possibly only a mention |
| HQ072725FE066 | Northrop Grumman Corporation | Department of Defense | Research and development | $15.48M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO VALIDATE A TECHNOLOGICALLY ADVANCED COMMUNICATION SYSTEM THAT ENSURES CONTINUOUS… | “microelectronic” possibly only a mention |
| 2315320 | Icamr, Inc. | National Science Foundation | Grants and other assistance | $15.00M | NSF ENGINES: CENTRAL FLORIDA SEMICONDUCTOR INNOVATION ENGINE -THIS NSF ENGINES AWARD TO THE CENTRAL FLORIDA SEMICONDUCTOR INNOVATION ENGINE WILL PLAY A CRITICAL ROLE IN BOLSTERING OUR NATION?S… | “semiconductor” |
| FA880721C0003 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Equipment and parts | $14.68M | GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER CARD PROGRAM WITH NEXT GENERATION APPLICATION SPECIFIC INTEGRATED CIRCUIT INCREMENT 2 | “integrated circuit” |
| HQ072726FE005 | Raytheon Company | Department of Defense | Research and development | $12.80M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR SMALL DIAMETER BOMB I. | “microelectronic” |
| HQ072723F1201 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Research and development | $12.03M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ANALYZE, AND DEVELOP THE NEXT GENERATION SIGNALS INTELLIGENCE. | “microelectronic” possibly only a mention |
| HQ072724F4002 | International Business Machines Corporation | Department of Defense | Engineering, technical and professional support | $10.61M | SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| HQ072726FE006 | Globalfoundries U.S. 2 LLC | Department of Defense | Equipment and parts | $10.41M | SOW 25-5G1 | “product or program code” |
| HQ072725FE042 | Northrop Grumman Corporation | Department of Defense | Research and development | $9.81M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO IMPROVE RELIABILITY, ENHANCE MAINTAINABILITY, AND INCREASE AVAILABILITY OF A… | “microelectronic” |
| HQ072726FE059 | Northrop Grumman Corporation | Department of Defense | Research and development | $9.73M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR CAPABILITY TO THE MICROELECTRONICS-BASED COUNTER SMALL UNMANNED AERIAL SYSTEM… | “microelectronic” possibly only a mention |
| HQ072724F4006 | International Business Machines Corporation | Department of Defense | Engineering, technical and professional support | $9.59M | SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| HQ072724F1421 | Northrop Grumman Corporation | Department of Defense | Research and development | $9.50M | ENGINEERING SERVICES- THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR MULTI-MISSION DRY SUBMERSIBLE, HOST CONVERSION. | “microelectronic” possibly only a mention |
| HQ072726FE037 | Lockheed Martin Corp | Department of Defense | Research and development | $8.50M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR RAGNAROK. | “microelectronic” possibly only a mention |
| N0016424F3004 | Amentum Services, Inc. | Department of Defense | Engineering, technical and professional support | $8.33M | BUSINESS OPERATIONS AND ENGINEERING SUPPORT SERVICES REQUIREMENTS IN SUPPORT OF THE MICROELECTRONICS DIVISION (CODE GXV) AT NAVAL SURFACE WARFARE CENTER (NSWC) CRANE. | “microelectronics” possibly only a mention |
| FA865023C1001 | Riverside Research Institute | Department of Defense | Research and development | $8.32M | MICROELECTRONICS AND EMBEDDED SYSTEM ASSURANCE II | “microelectronics” |
| FA860624FB004 | Gentex Corporation | Department of Defense | Equipment and parts | $8.31M | AIRCREW LASER EYE PROTECTION (ALEP) NIGHT SPECTACLES DELIVERY ORDER | “product or program code” |
| HQ072724F1105 | Lockheed Martin Corp | Department of Defense | Research and development | $8.25M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ADD CAPABILITY AND IMPROVE PERFORMANCE OF THE MICROELECTRONICS-BASED SCALED… | “microelectronic” |
| HQ072724F1405 | Northrop Grumman Corporation | Department of Defense | Research and development | $7.91M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ARMY INTEGRATED BATTLE COMMAND SYSTEM CAPABILITIES UPGRADE INCLUDING JOINT… | “microelectronic” possibly only a mention |
| HQ072723F0100 | Blackwatch International Corporation | Department of Defense | Maintenance, repair and field support | $7.61M | MANUFACTURING SUSTAINMENT AND ENGINEERING SUPPORT SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| 2532464 | Oregon State University | National Science Foundation | Grants and other assistance | $7.50M | NSF FAST ENGINE IN OREGON -SEMICONDUCTORS ARE VITALLY IMPORTANT TO THE U.S. ECONOMY AND NATIONAL SECURITY, POWERING EVERYTHING FROM CONSUMER ELECTRONICS TO CRITICAL DEFENSE SYSTEMS. THE FRONTIERS OF… | “semiconductors” |
| HQ072725FE093 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Research and development | $6.77M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ADD CAPABILITY AND AVAILABILITY TO THE EXISTING DEPLOYED ASSET TAGGING AND TRACKING… | “microelectronic” possibly only a mention |
| HQ072726FE057 | Northrop Grumman Corporation | Department of Defense | Maintenance, repair and field support | $6.49M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM V (ATSP5) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR AMDPCS SYSTEMS. | “microelectronic” |
| W911NF262A096 | University of Arkansas | Department of Defense | Grants and other assistance | $6.43M | TOWARDS A SILICON CARBIDE (SIC) COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) PROCESS FOR ADVANCED INTEGRATION | “semiconductor” |
| W911NF2520094 | University of Arkansas | Department of Defense | Grants and other assistance | $6.17M | (NO IDC) SILICON CARBIDE SEMICONDUCTOR RESEARCH FABRICATION LINE | “semiconductor” |
| 2546677 | Boise State University | National Science Foundation | Grants and other assistance | $6.00M | E-RISE: CAPACITY BUILDING FOR RESILIENT MICROELECTRONICS FOR EXTREME ENVIRONMENTS (XTREME) PROGRAM -THE IDAHO EPSCOR JURISDICTION'S E?RISE PROJECT, CAPACITY BUILDING FOR RESILIENT MICROELECTRONICS… | “microelectronics” |
| HQ072725FE051 | Raytheon Company | Department of Defense | Research and development | $6.00M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR BATTLE MANAGEMENT COMMAND AND CONTROL (BMC2) ENHANCEMENT PROGRAM, CET 25-558. | “microelectronic” possibly only a mention |
| DEEE0011003 | North Carolina State University | Department of Energy | Grants and other assistance | $6.00M | POWERAMERICA: A WIDE BANDGAP SEMICONDUCTOR MANUFACTURING INSTITUTE | “semiconductor” |
| HQ072725FE037 | Lockheed Martin Corp | Department of Defense | Research and development | $5.90M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR HAMMER. | “microelectronic” possibly only a mention |
| HQ072724F4005 | International Business Machines Corporation | Department of Defense | Engineering, technical and professional support | $5.90M | SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| 2607536 | The Pennsylvania State University | National Science Foundation | Grants and other assistance | $5.48M | PCL-TEST BED: LAYERED AND THIN-FILM TECHNOLOGIES WITH INTELLIGENT CLOUD EXPERIMENTATION (LATTICE) -PCL-TEST BED: LAYERED AND THIN-FILM TECHNOLOGIES WITH INTELLIGENT CLOUD EXPERIMENTATION (LATTICE)… | “semiconductor” possibly only a mention |
| HQ072724F1619 | Raytheon Company | Department of Defense | Research and development | $5.39M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS. | “microelectronic” possibly only a mention |
| HQ072725FE046 | Globalfoundries U.S. 2 LLC | Department of Defense | Research and development | $5.29M | 25-5D8 TFA3-M CY25 CSA RAYTHEON | “product or program code” |
| HQ072726FE047 | Raytheon Company | Department of Defense | Research and development | $5.18M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR INFINITEVISION IV. | “microelectronic” possibly only a mention |
| FA865023C1000 | Battelle Memorial Institute | Department of Defense | Research and development | $5.01M | MICROELECTRONICS EMBEDDED SYSTEM AND ASSURANCE II | “microelectronics” |
| 2607580 | Virginia Polytechnic Institute & State University | National Science Foundation | Grants and other assistance | $5.00M | NSF PCL-TEST BED: AI-ENABLED, CLOUD-BASED SELF-DRIVING NANOFABRICATION NODE FOR ACCELERATING SEMICONDUCTOR RESEARCH AND EDUCATION -NSF PCL-TEST BED: AI-ENABLED, CLOUD-BASED SELF-DRIVING… | “semiconductor” |
| 2607553 | William Marsh Rice University | National Science Foundation | Grants and other assistance | $4.98M | PCL-TEST BED: REVOLUTIONIZING AI-DRIVEN AUTONOMOUS EXPERIMENTATION FOR NEXT-GENERATION SEMICONDUCTOR SYNTHESIS (READINESS) -PCL-TEST BED: REVOLUTIONIZING AI-DRIVEN AUTONOMOUS EXPERIMENTATION FOR… | “semiconductor” possibly only a mention |