Putting the topic page together from the records…
Putting the topic page together from the records…
The current fiscal year is still being reported (Defense contracts arrive about 90 days late).
Awards are tagged by words in their description; Jev (an AI that answers yes/no with a probability, not text) judged whether each of the 3,542 word-tagged awards is really about semiconductors and microelectronics and which kind. The numbers themselves come from the records. The largest left out:
Each award's description says which side it's on; its product or service code says what kind of purchase it is.
| Type | Kind of purchase | Obligations | Awards | Leading suppliers |
|---|---|---|---|---|
| Research and development | $1.01B | 194 | Raytheon Company · Northrop Grumman Corporation · Lockheed Martin Corp | |
| Equipment and parts | $206.97M | 3,455 | Bae Systems Information and Electronic Systems Integration Inc. · L3Harris Technologies, Inc · Globalfoundries U.S. 2 LLC | |
| Grants and other assistance | $191.22M | 515 | Srcco Inc. · Texas Tech University System · New York University | |
| Maintenance, repair and field support | $79.67M | 37 | Northrop Grumman Corporation · Bae Systems Information and Electronic Systems Integration Inc. · Lockheed Martin Corp | |
| Engineering, technical and professional support | $77.21M | 27 | Globalfoundries U.S. 2 LLC · International Business Machines Corporation · Amentum Services, Inc. | |
| Other services | $7.66M | 7 | Gilbane-Exyte a Joint Venture · Fortis Native Group LLC · CH2M - Burns & Mcdonnell Joint Venture | |
| IT and data | $1.12M | 9 | Carahsoft Technology Corp · Chakra Consulting, Inc. · Prometheus Computing, LLC |
Companies with semiconductors and microelectronics contracts, largest first (the top 30 of 749). Grants are listed below.
| Supplier | Obligations | Contracts | What | Buyers | Largest contract |
|---|---|---|---|---|---|
| Raytheon Company | $467.13M | 83 | Research and development · Maintenance, repair and field support | Department of Defense · National Aeronautics and Space Administration | HQ072725FE061 · $263.00M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE… |
| Northrop Grumman Corporation | $184.68M | 39 | Research and development · Maintenance, repair and field support | Department of Defense · Department of the Interior | HQ072725FE023 · $45.13M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE… |
| Lockheed Martin Corp | $128.03M | 18 | Research and development · Maintenance, repair and field support | Department of Defense | HQ072725FE037 · $21.21M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE… |
| Bae Systems Information and Electronic Systems Integration Inc. | $86.32M | 29 | Research and development · Maintenance, repair and field support | Department of Defense | HQ072725FE002 · $18.31M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE… |
| Globalfoundries U.S. 2 LLC | $81.63M | 6 | Engineering, technical and professional support · Equipment and parts | Department of Defense |
Each opens its own page: every action, the terms, and who the money went to next. “Why here” is the word in its description that tagged it.
| Award | To | Agency | What | Obligations | Description | Why here |
|---|---|---|---|---|---|---|
| HQ072725FE061 | Raytheon Company | Department of Defense | Research and development | $263.00M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR CONTINUED REFINEMENT, ENHANCEMENT, AND DELIVERY OF SENSE AND INTERCEPT EQUIPMENT | “microelectronic” possibly only a mention |
| HQ072725FE077 | Raytheon Company | Department of Defense | Research and development | $90.68M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR MOBILE OBSOLESCENCE AND PRODUCTION READINESS | “microelectronic” |
| FA807524F0002 | Amentum Services, Inc. | Department of Defense | Research and development | $63.17M | MICROELECTRONICS FACILITIES AND LABORATORIES RESEARCH, DEVELOPMENT, TEST, AND EVALUATION FOR THE NAVAL SURFACE WARFARE CENTER CRANE STRATEGIC MICROELECTRONICS DIVISION AND THE NAVY STRATEGIC SYSTEMS… | “microelectronics” |
| FA880721C0003 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Equipment and parts | $60.74M | GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER CARD PROGRAM WITH NEXT GENERATION APPLICATION SPECIFIC INTEGRATED CIRCUIT INCREMENT 2 | “integrated circuit” |
How awards are tagged: their product or program code, or words in the award's original description (chips, CHIPS Act, semiconductor, microelectronics…), minus known noise. A description can mention the topic in passing, so check an award's own page. Source: USAspending.gov prime awards, FY2023 on; amounts are obligations (money committed), not outlays.
| HQ072725FE022 · $37.50M · THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION… |
| Amentum Services, Inc. | $68.31M | 2 | Research and development · Engineering, technical and professional support | Department of Defense | FA807524F0002 · $63.17M · MICROELECTRONICS FACILITIES AND LABORATORIES RESEARCH, DEVELOPMENT, TEST, AND EVALUATION… |
| Bae Systems Information and Electronic Systems Integration Inc. | $61.42M | 3 | Equipment and parts | Department of Defense | FA880721C0003 · $60.74M · GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER… |
| L3Harris Technologies, Inc | $44.46M | 8 | Equipment and parts | Department of Defense | FA880721C0005 · $34.01M · GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER… |
| International Business Machines Corporation | $37.21M | 9 | Engineering, technical and professional support · Equipment and parts | Department of Defense · Department of Commerce | HQ072724F4002 · $10.28M · SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR… |
| Booz Allen Hamilton Inc | $23.03M | 3 | Research and development | Department of Defense | FA807521F0005 · $19.75M · MICROELECTRONICS ASSURANCE FOR SECURE TRUSTWORTHY ELECTRONICS RESEARCH (MASTER) |
| Battelle Memorial Institute | $17.42M | 2 | Research and development | Department of Defense | FA237724CB012 · $12.81M · R AND D FOR TECHNOLOGY SOLUTIONS WITH BUILT-IN TRUST MEASURES/TECHNIQUES THAT MEET DODS… |
| Nimbis Services Inc | $13.51M | 1 | Research and development | General Services Administration | 47QFLA22F0175 · $13.51M · QUANTIFIABLY ASSURED MICROELECTRONICS EMULATION ECOSYSTEM QAMEE |
| Electric Boat Corporation | $13.05M | 4 | Research and development · Equipment and parts | Department of Defense | HQ072725FE003 · $9.24M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE… |
| Honeywell International Inc. | $12.36M | 1 | Research and development | Department of Defense | HQ072725FE068 · $12.36M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE… |
| Auburn University | $11.40M | 1 | Research and development | Department of Defense | HQ086025C6001 · $11.40M · RADIATION HARDENED MICROELECTRONICS TESTING FACILITY |
| Riverside Research Institute | $9.27M | 2 | Research and development | Department of Defense | FA865023C1001 · $9.27M · MICROELECTRONICS AND EMBEDDED SYSTEM ASSURANCE II |
| Blackwatch International Corporation | $8.95M | 2 | Maintenance, repair and field support | Department of Defense | HQ072723F0100 · $8.95M · MANUFACTURING SUSTAINMENT AND ENGINEERING SUPPORT SERVICES TO DESIGN, FABRICATE,… |
| Silicon Technologies Inc | $4.78M | 1 | Research and development | Department of Defense | FA945323CA036 · $4.78M · ADVANCED ANALOG & MIXED SIGNAL RAD HARD MICROELECTRONICS DESIGN AND MANUFACTURING PROGRAM. |
| Gilbane-Exyte a Joint Venture | $3.84M | 1 | Other services | Department of Defense | W912WJ22C0002 · $3.84M · CONSTRUCTION OF ADVANCED COMPOUND SEMICONDUCTOR LABORATORY/MICROSYSTEM INTEGRATION… |
| The Pennsylvania State University | $3.68M | 2 | Research and development | Department of the Interior · Department of Defense | 140D0424C0065 · $2.31M · LARGE AREA, HIGH QUALITY ELECTRONIC GRADE DIAMOND VIA INNOVATIVE SEED CLONING AND TILING… |
| General Micro Systems, Inc | $3.56M | 1 | Equipment and parts | Department of Defense | N0010425CDA03 · $3.56M · DISPLAY,OPTOELECTRO |
| Fortis Native Group LLC | $2.66M | 1 | Other services | Department of Defense | HQ072723F0500 · $2.66M · PREVENTATIVE MAINTENANCE SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE,… |
| Lintech Components Co. Inc. | $2.47M | 282 | Equipment and parts | Department of Defense | SPE7M125P6326 · $141.3K · 8511345848!TRANSISTOR |
| Caes Systems LLC | $2.01M | 3 | Research and development · Equipment and parts | Department of Defense | HQ072725FE025 · $1.98M · THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE… |
| Bogue Systems Inc | $1.95M | 6 | Equipment and parts | Department of Defense | N0010425CDA08 · $2.00M · ASSEMBLY,POWER MODU |
| Fuceltech Inc | $1.90M | 1 | Research and development | Department of Defense | W5170125CA005 · $1.90M · PHOTONIC CRYSTAL SURFACE EMITTING SEMICONDUCTOR LASER (PHASE II SEQUENTIAL) |
| Icamr, Inc. | $1.80M | 1 | Research and development | Department of Defense | FA865020C1911 · $1.80M · TRUSTED SEMICONDUCTOR MANUFACTURING PILOT PROJECT |
| Saaz Micro, Inc. | $1.76M | 1 | Research and development | Department of Defense | FA237725CB011 · $1.76M · RAD-HARD EVENT-BASED ASYNCHRONOUS READOUT INTEGRATED CIRCUIT |
| Recon RF, Inc. | $1.75M | 2 | Research and development | Department of Defense | FA864925P0515 · $1.75M · ADVANCED SEMICONDUCTOR PRODUCTION OF NEXT-GEN X-BAND SOLID-STATE POWER AMPLIFIED FOR… |
| Eldec Aerospace Corp | $1.74M | 4 | Equipment and parts | Department of Defense | SPE7M825P1301 · $776.2K · 8511312219!SWITCH,PROXIMITY |
| HQ072725FE023 | Northrop Grumman Corporation | Department of Defense | Research and development | $45.13M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ADD CAPABILITY, IMPROVE PERFORMANCE, RELIABILITY, MAINTAINABILITY OF A… | “microelectronic” possibly only a mention |
| HQ072724F1610 | Raytheon Company | Department of Defense | Research and development | $38.76M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ADVANCED TECHNOLOGY MAINTAINABILITY OF THE MICROELECTRONICS-BASED COUNTER… | “microelectronic” possibly only a mention |
| HQ072725FE022 | Globalfoundries U.S. 2 LLC | Department of Defense | Engineering, technical and professional support | $37.50M | THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION SPECIFIC INTEGRATED CIRCUITS. (ASIC) | “foundry” |
| FA880721C0005 | L3Harris Technologies, Inc | Department of Defense | Equipment and parts | $34.01M | GLOBAL POSITIONING SYSTEM MILITARY USERS EQUIPMENT MINIATURE SERIAL INTERFACE RECEIVER CARD PROGRAM WITH NEXT GENERATION APPLICATION SPECIFIC INTEGRATED CIRCUIT INCREMENT | “integrated circuit” |
| HQ072723F4100 | Globalfoundries U.S. 2 LLC | Department of Defense | Equipment and parts | $27.62M | THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION SPECIFIC INTEGRATED CIRCUITS (ASIC) | “foundry” |
| HR00112330002 | Srcco Inc. | Department of Defense | Grants and other assistance | $24.00M | PURPOSE OF THE DEPARTMENT OF DEFENSE INDUSTRY RESEARCH COLLABORATION IN THE JOINT UNIVERSITY MICROELECTRONICS PROGRAM 2.0 JUMP 2.0 THE JOINT UNIVERSITY MICROELECTRONICS PROGRAM 2.0 JUMP 2.0 WILL… | “microelectronics” |
| HQ072725FE048 | Northrop Grumman Corporation | Department of Defense | Maintenance, repair and field support | $22.70M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ANALYZE, DESIGN, AND DEVELOP ADVANCED TECHNOLOGY MICROELECTRONIC SOLUTIONS TO… | “microelectronic” |
| HQ072725FE037 | Lockheed Martin Corp | Department of Defense | Research and development | $21.21M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR HAMMER. | “microelectronic” possibly only a mention |
| HQ072725FE029 | Raytheon Company | Department of Defense | Research and development | $20.51M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR AN/APG-79(V)1 WIDE BAND RECEIVER UPGRADE PROGRAM | “microelectronic” |
| FA807521F0005 | Booz Allen Hamilton Inc | Department of Defense | Research and development | $19.75M | MICROELECTRONICS ASSURANCE FOR SECURE TRUSTWORTHY ELECTRONICS RESEARCH (MASTER) | “microelectronics” |
| HQ072725FE002 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Research and development | $18.31M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR THE MICROELECTRONICS-BASED RANGE CONTROL CENTER COMPLEX SYSTEM | “microelectronic” possibly only a mention |
| HQ072725FE057 | Lockheed Martin Corp | Department of Defense | Research and development | $17.72M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR F-16 IRST CAPABILITY, CET 25-535. | “microelectronic” possibly only a mention |
| HQ072724F1421 | Northrop Grumman Corporation | Department of Defense | Research and development | $17.52M | ENGINEERING SERVICES- THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR MULTI-MISSION DRY SUBMERSIBLE, HOST CONVERSION. | “microelectronic” possibly only a mention |
| HQ072725FE020 | Lockheed Martin Corp | Department of Defense | Research and development | $16.87M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR B-52H AVIONICS CONTROL UNIT (ACU) REDESIGN | “microelectronic” |
| W56KGY25F0158 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Maintenance, repair and field support | $16.37M | PROVIDE ALL PERSONNEL, EQUIPMENT, SUPPLIES, FACILITIES, TOOLS, MATERIALS, SUPERVISION, AND OTHER ITEM AND NON-PERSONAL SERVICES NECESSARY TO PERFORM THE CONTRACTOR SUPPORT OF THE COMMON MISSILE… | “product or program code” |
| HQ072724F1102 | Lockheed Martin Corp | Department of Defense | Research and development | $16.07M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR SYSTEM DEVELOPMENT, INTEGRATION AND TEST. | “microelectronic” possibly only a mention |
| HQ072725FE050 | Lockheed Martin Corp | Department of Defense | Maintenance, repair and field support | $15.64M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR MH-60 AWI | “microelectronic” possibly only a mention |
| HQ072725F1100 | Lockheed Martin Corp | Department of Defense | Research and development | $14.48M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR UPGRADES TO AN AUTOMATED TEST SYSTEM. | “microelectronic” possibly only a mention |
| HQ072724F1405 | Northrop Grumman Corporation | Department of Defense | Research and development | $13.58M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ARMY INTEGRATED BATTLE COMMAND SYSTEM CAPABILITIES UPGRADE INCLUDING JOINT… | “microelectronic” possibly only a mention |
| 47QFLA22F0175 | Nimbis Services Inc | General Services Administration | Research and development | $13.51M | QUANTIFIABLY ASSURED MICROELECTRONICS EMULATION ECOSYSTEM QAMEE | “microelectronics” |
| HQ072725FE067 | Northrop Grumman Corporation | Department of Defense | Research and development | $13.48M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO IMPROVE RELIABILITY OF THE MICROELECTRONICS-BASED B-2 FLIGHT CONTROL COMPUTER… | “microelectronic” |
| FA237724CB012 | Battelle Memorial Institute | Department of Defense | Research and development | $12.81M | R AND D FOR TECHNOLOGY SOLUTIONS WITH BUILT-IN TRUST MEASURES/TECHNIQUES THAT MEET DODS REQUIREMENT WITH FOCUS ON DESIGN ASSURANCE, VALIDATION AND VERIFICATION, AND MICROELECTRONICS SUPPLY CHAIN… | “microelectronics” possibly only a mention |
| HQ072725FE068 | Honeywell International Inc. | Department of Defense | Research and development | $12.36M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR B-1 MSOGS. | “microelectronic” possibly only a mention |
| HQ072725FE089 | Northrop Grumman Corporation | Department of Defense | Research and development | $12.13M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR RADARS. | “microelectronic” possibly only a mention |
| HQ072723F1201 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Research and development | $12.13M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ANALYZE, AND DEVELOP THE NEXT GENERATION SIGNALS INTELLIGENCE. | “microelectronic” possibly only a mention |
| HQ086025C6001 | Auburn University | Department of Defense | Research and development | $11.40M | RADIATION HARDENED MICROELECTRONICS TESTING FACILITY | “microelectronics” |
| HQ072724F1426 | Northrop Grumman Corporation | Department of Defense | Research and development | $11.20M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO ADD CAPABILITY AND IMPROVE PERFORMANCE OF THE MICROELECTRONICS-BASED SCALED… | “microelectronic” |
| HQ072724F4002 | International Business Machines Corporation | Department of Defense | Engineering, technical and professional support | $10.28M | SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| FA830725FB065 | L3Harris Technologies, Inc | Department of Defense | Equipment and parts | $10.28M | ADVANCED EXTREMELY HIGH FREQUENCY COMMUNICATIONS SECURITY TRANSMISSION SECURITY SYSTEMS AND CRYPTOGRAPHIC CORE PROCESSOR APPLICATION SPECIFIC INTEGRATED CIRCUIT PRODUCTION | “integrated circuit” |
| 2560IF2414 | Analog Devices, Inc. | Department of Commerce | Grants and other assistance | $9.98M | PURPOSE: ANALOG DEVICES INTENDS TO ACCELERATE THE DEVELOPMENT OF 5NM COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR RADIO TRANSCEIVER ASIC (APPLICATION-SPECIFIC INTEGRATED CIRCUIT) COMPONENTS,… | “semiconductor” |
| 3460IF2412 | Otava RF, Inc. | Department of Commerce | Grants and other assistance | $9.97M | PURPOSE: OTAVA PLANS TO DEVELOP AN INTEGRATED RF (RADIO FREQUENCY) FRONT-END FOR A HIGHLY EFFECTIVE DUAL BAND CONCEPT SUPPORTING FR3 (FREQUENCY RANGE) DEPLOYMENTS THAT INCLUDE SIMULTANEOUS USE OF… | “integrated circuit” possibly only a mention |
| 3660IF2419 | New York University | Department of Commerce | Grants and other assistance | $9.96M | PURPOSE: THIS PROJECT DEVELOPS SALSA (SPECTRALLY AGILE LARGE-SCALE ARRAYS), A WIDEBAND, SPECTRALLY AGILE AND SCALABLE RADIO FREQUENCY INTEGRATED CIRCUIT (RFIC) AND TRANSCEIVER FOR USE IN FUTURE… | “integrated circuit” |
| HQ072725FE009 | Raytheon Company | Department of Defense | Maintenance, repair and field support | $9.86M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS | “microelectronic” possibly only a mention |
| HQ072725FE079 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Research and development | $9.40M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM CONTRACT ACQUIRED MICROELECTRONIC CAPABILITY SOLUTIONS TO RESOLVE OBSOLESCENCE ISSUES, ADD CAPABILITY, IMPROVE RELIABILITY, MAINTAINABILITY, AND AVAILABILITY… | “microelectronic” |
| HQ072724F4006 | International Business Machines Corporation | Department of Defense | Engineering, technical and professional support | $9.39M | SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| FA865023C1001 | Riverside Research Institute | Department of Defense | Research and development | $9.27M | MICROELECTRONICS AND EMBEDDED SYSTEM ASSURANCE II | “microelectronics” |
| HQ072725FE003 | Electric Boat Corporation | Department of Defense | Research and development | $9.24M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONICS CAPABILITY SOLUTIONS FOR ENGINEERING SERVICES TO MITIGATE OBSOLESCENCE OF THE CURRENT AIRSPACE… | “microelectronics” possibly only a mention |
| HQ072723F0100 | Blackwatch International Corporation | Department of Defense | Maintenance, repair and field support | $8.95M | MANUFACTURING SUSTAINMENT AND ENGINEERING SUPPORT SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| HQ072724F1603 | Raytheon Company | Department of Defense | Research and development | $8.90M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR SOFTWARE SOLUTIONS TO ADD CAPABILITY AND IMPROVE PERFORMANCE OF THE… | “microelectronic” possibly only a mention |
| HQ072725F1200 | Bae Systems Information and Electronic Systems Integration Inc. | Department of Defense | Research and development | $8.14M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRED PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO IMPROVE PERFORMANCE OF THE MICROELECTRONICS-BASED AN/ASQ-239 | “microelectronic” |
| HQ072725FE031 | Globalfoundries U.S. 2 LLC | Department of Defense | Research and development | $8.09M | SOW 25-5C9 | “product or program code” |
| HQ072724F4001 | International Business Machines Corporation | Department of Defense | Engineering, technical and professional support | $8.01M | SERVICES TO DESIGN, FABRICATE, ASSEMBLE, BUILD, TEST, EVALUATE, VERIFY, VALIDATE, AND/OR PROCURE MICROELECTRONICS AND OPERATE SUCH A FACILITY. | “microelectronics” |
| HQ072724F4100 | Globalfoundries U.S. 2 LLC | Department of Defense | Equipment and parts | $7.79M | THE TRUSTED FOUNDRY ACCESS (TFA) CONTRACT ACQUIRED SUPPLIES ASSOCIATED WITH APPLICATION SPECIFIC INTEGRATED CIRCUITS (ASIC) | “foundry” |
| HQ072724F1100 | Lockheed Martin Corp | Department of Defense | Research and development | $7.67M | CET 23-320, ANALYZE, DEVELOP AND INTEGRATE AN ADVANCED TECHNOLOGY MICROELECTRONIC PODDED IRST SYSTEM SOLUTION TO ADD CAPABILITY TO THE MICROELECTRONICS-BASED F-16 FIGHTING FALCON. | “microelectronic” possibly only a mention |
| HQ072725FE001 | Lockheed Martin Corp | Department of Defense | Research and development | $7.54M | THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ECASS. THE ACTION IS AWARD A NEW TASK. | “microelectronic” |
| 2514718 | Texas State University | National Science Foundation | Grants and other assistance | $7.50M | CREST PHASE I CENTER FOR ULTRAWIDE BANDGAP SEMICONDUCTOR DEVICE MATERIALS -WITH SUPPORT FROM THE CENTERS OF RESEARCH EXCELLENCE IN SCIENCE AND TECHNOLOGY (CREST) AND THE ENGINEERING RESEARCH CENTERS… | “semiconductor” |